CD74FCT245

활성

3상 출력을 지원하는 BiCMOS FCT 인터페이스 로직 8진 비인버팅 버스 트랜시버

제품 상세 정보

Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -15 Input type TTL Output type TTL Features Very high speed (tpd 5-10ns) Technology family FCT Rating Catalog Operating temperature range (°C) 0 to 70
Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -15 Input type TTL Output type TTL Features Very high speed (tpd 5-10ns) Technology family FCT Rating Catalog Operating temperature range (°C) 0 to 70
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • BiCMOS Technology With Low Quiescent Power
  • Buffered Inputs
  • Noninverted Outputs
  • Input/Output Isolation From VCC
  • Controlled Output Edge Rates
  • 64-mA Output Sink Current
  • Output Voltage Swing Limited to 3.7 V
  • SCR Latch-Up-Resistant BiCMOS Process and Circuit Design
  • Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP
  • BiCMOS Technology With Low Quiescent Power
  • Buffered Inputs
  • Noninverted Outputs
  • Input/Output Isolation From VCC
  • Controlled Output Edge Rates
  • 64-mA Output Sink Current
  • Output Voltage Swing Limited to 3.7 V
  • SCR Latch-Up-Resistant BiCMOS Process and Circuit Design
  • Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP

The CD74FCT245 is an octal bus transceiver with 3-state outputs using a small-geometry BiCMOS technology. The output stages are a combination of bipolar and CMOS transistors that limit the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces the power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 64 mA.

The CD74FCT245 allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction-control (DIR) input. The output-enable (OE\) input can be used to disable the device so that the buses are effectively isolated.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The CD74FCT245 is characterized for operation from 0°C to 70°C.

The CD74FCT245 is an octal bus transceiver with 3-state outputs using a small-geometry BiCMOS technology. The output stages are a combination of bipolar and CMOS transistors that limit the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces the power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 64 mA.

The CD74FCT245 allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction-control (DIR) input. The output-enable (OE\) input can be used to disable the device so that the buses are effectively isolated.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The CD74FCT245 is characterized for operation from 0°C to 70°C.

다운로드

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
SN74AHCT245 활성 3상 출력을 지원하는 8진 버스 트랜시버 Larger voltage range (2V to 5.5V)

기술 자료

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* Data sheet BiCMOS Octal Bus Transceiver With 3-State Outputs datasheet 2000/07/02

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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