SN54F245
- 3-State Outputs Drive Bus Lines Directly
- Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
These octal bus transceivers are designed for asynchronous
communication between data buses. The devices transmit data from the
A bus to the B bus or from the B bus to the A bus depending upon the
logic level at the direction-control (DIR) input. The output enable
input can be
used to disable the device so the buses are effectively isolated.
The SN74F245 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F245 is characterized for operation from 0°C to 70°C.
관심 가지실만한 유사 제품
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Octal Bus Transceivers With 3-State Outputs datasheet (Rev. A) | 1993/10/01 | |
| * | SMD | SN54F245 SMD 85511012A | 2016/06/21 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997/08/01 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 |
설계 및 개발
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주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치