제품 상세 정보

Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 6 IOH (max) (mA) -6 Supply current (max) (µA) 80 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns) Rating Military Operating temperature range (°C) -55 to 125
Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 6 IOH (max) (mA) -6 Supply current (max) (µA) 80 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns) Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92
  • Operating Voltage Range of 4.5 V to 5.5 V
  • Low Power Consumption, 80-µA Max ICC
  • Typical tpd = 12 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Inputs Are TTL-Voltage Compatible
  • High-Current 3-State Outputs Interface Directly With System Bus or Can Drive Up To 15 LSTTL Loads
  • Data Flow-Through Pinout (All Inputs on Opposite Side From Outputs)

  • Operating Voltage Range of 4.5 V to 5.5 V
  • Low Power Consumption, 80-µA Max ICC
  • Typical tpd = 12 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Inputs Are TTL-Voltage Compatible
  • High-Current 3-State Outputs Interface Directly With System Bus or Can Drive Up To 15 LSTTL Loads
  • Data Flow-Through Pinout (All Inputs on Opposite Side From Outputs)

These octal buffers and line drivers are designed to have the performance of the ’HCT240 devices and a pinout with inputs and outputs on opposite sides of the package. This arrangement greatly facilitates printed circuit board layout.

The 3-state control gate is a 2-input NOR. If either output-enable (OE1\ or OE2\) input is high, all eight outputs are in the high-impedance state. The ’HCT540 devices provide inverted data at the outputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These octal buffers and line drivers are designed to have the performance of the ’HCT240 devices and a pinout with inputs and outputs on opposite sides of the package. This arrangement greatly facilitates printed circuit board layout.

The 3-state control gate is a 2-input NOR. If either output-enable (OE1\ or OE2\) input is high, all eight outputs are in the high-impedance state. The ’HCT540 devices provide inverted data at the outputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 유사한 기능
신규 SN74LV14B-EP 활성 향상된 제품, 슈미트 트리거 입력을 지원하는 6채널 2V~5.5V 인버터 Voltage range (2V to 5.5V), average drive strength (12mA), average propagation delay (9ns)

기술 문서

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모두 보기13
유형 직함 날짜
* Data sheet SN54HCT540, SN74HCT540 datasheet (Rev. C) 2003/03/18
* Radiation & reliability report SNJ54HCT540J Reliability Report 2011/08/31
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 1996/05/01
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996/04/01

설계 및 개발

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패키지 다운로드
CDIP (J) 20 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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