SN55LVCP22-SP
- High Speed (>1000 Mbps) Upgrade for DS90CP22 2x2 LVDS
Crosspoint Switch - Low-Jitter Fully Differential Data Path
- 50 ps (Typ), of Peak-to-Peak Jitter With PRBS = 223–1 Pattern
- Less Than 200 mW (Typ), 300 mW (Max) Total Power Dissipation
- Output (Channel-to-Channel) Skew Is 80 ps (Typ)
- Configurable as 2:1 Mux, 1:2 Demux, Repeater or 1:2 Signal Splitter
- Inputs Accept LVDS, LVPECL, and CML Signals
- Fast Switch Time of 1.7 ns (Typ)
- Fast Propagation Delay of 0.65 ns (Typ)
- Available in 16 pin CFP Package
- Inter-Operates With TIA/EIA-644-A LVDS Standard
- Military Temperature Range: –55°C to 125°C
The SN55LVCP22 is a 2×2 crosspoint switch providing greater than 1000 Mbps operation for each path. The dual channels incorporate wide common-mode (0 V to 4 V) receivers, allowing for the receipt of LVDS, LVPECL, and CML signals. The dual outputs are LVDS drivers to provide low-power, low-EMI, high-speed operation. The SN55LVCP22 provides a single device supporting 2:2 buffering (repeating), 1:2 splitting, 2:1 multiplexing, 2×2 switching, and LVPECL/CML to LVDS level translation on each channel. The flexible operation of the SN55LVCP22 provides a single device to support the redundant serial bus transmission needs (working and protection switching cards) of fault-tolerant switch systems found in optical networking, wireless infrastructure, and data communications systems. TI offers additional gigabit repeater/ translator and crosspoint products in the SN65LVDS100 and SN65LVDS122.
The SN55LVCP22 uses a fully differential data path to ensure low-noise generation, fast switching times, low pulse width distortion, and low jitter. Output channel-to- channel skew is 80 ps (typ) to ensure accurate alignment of outputs in all applications. Both SOIC and TSSOP package options are available to allow easy upgrade for existing solutions, and board area savings where space is critical.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Class V 2x2 LVDS Crosspoint Switch datasheet (Rev. A) | 2014/01/02 | |
| * | SMD | SN55LVCP22-SP SMD 5962-11242 | 2016/07/08 | |
| * | Radiation & reliability report | SN55LVCP22-SP TID Report | 2015/03/31 | |
| More literature | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) | 2023/08/31 | ||
| Application note | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) | PDF | HTML | 2022/11/17 | |
| Application note | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 2022/10/19 | |
| Selection guide | TI Space Products (Rev. I) | 2022/03/03 | ||
| EVM User's guide | SN55LVCP22EVM-CVAL Users Guide | 2012/12/10 |
설계 및 개발
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SN55LVCP22EVM-CVAL — SN55LVCP22-SP 평가 모듈
The SN55LVCP22 (LVDS output) is a high-speed 2x2 crosspoint switch. The four different functions that this crosspoint provides are shown below. The functions are selected via pins SEL0 and SEL1. Control pins EN0 and EN1 enable or disable the outputs. The receiver has a wide input common-mode (...)
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| CFP (W) | 16 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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