SN74ACT16245-EP
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of –40°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product Change Notification
- Qualification Pedigree
- Member of the Texas Instruments Widebus™ Family
- Inputs Are TTL-Voltage Compatible
- 3-State Outputs Drive Bus Lines Directly
- Flow-Through Architecture Optimizes PCB Layout
- Distributed VCC and GND Pins Minimize High-Speed Switching Noise
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, highly accelerated stress test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life.
Widebus is a trademark of Texas Instruments.
The SN74ACT16245Q-EP is a 16-bit bus transceiver organized as dual-octal noninverting 3-state transceivers and designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.
The device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The enable (G)\ input can be used to disable the devices so that the buses are effectively isolated.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 16-Bit Bus Transceiver With 3-State Outputs datasheet (Rev. A) | 2002/07/09 | |
| * | VID | SN74ACT16245-EP VID V6203601 | 2016/06/21 | |
| Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021/07/26 | ||
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997/06/01 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996/04/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SSOP (DL) | 48 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치