SN74ALVTH162244

구형

버스 홀드, TTL 호환 CMOS 입력 및 3상 출력을 지원하는 16채널, 2.3V~3.6V 버퍼

제품 상세 정보

Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 12 Supply current (max) (µA) 5000 IOH (max) (mA) -12 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Damping resistors, Over-voltage tolerant inputs Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 12 Supply current (max) (µA) 5000 IOH (max) (mA) -12 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Damping resistors, Over-voltage tolerant inputs Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Power Off Disables Outputs, Permitting Live Insertion
  • High-Impedance State During Power Up and Power Down Prevents Driver Conflict
  • Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Output Ports Have Equivalent 30- Series Resistors, So No External Resistors Are Required
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model; and Exceeds 1000 V Using Charged-Device Model, Robotic Method
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

NOTE: For order entry:
The DGG package is abbreviated to G, and
the DGV package is abbreviated to V.

Widebus is a trademark of Texas Instruments Incorporated.

  • State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Power Off Disables Outputs, Permitting Live Insertion
  • High-Impedance State During Power Up and Power Down Prevents Driver Conflict
  • Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Output Ports Have Equivalent 30- Series Resistors, So No External Resistors Are Required
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model; and Exceeds 1000 V Using Charged-Device Model, Robotic Method
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

NOTE: For order entry:
The DGG package is abbreviated to G, and
the DGV package is abbreviated to V.

Widebus is a trademark of Texas Instruments Incorporated.

The 'ALVTH162244 devices are 16-bit buffers/line drivers designed for low-voltage 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable (OE\) inputs.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

All outputs are designed to sink up to 12 mA and include equivalent 30- resistors to reduce overshoot and undershoot.

The SN54ALVTH162244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH162244 is characterized for operation from -40°C to 85°C.

The 'ALVTH162244 devices are 16-bit buffers/line drivers designed for low-voltage 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable (OE\) inputs.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

All outputs are designed to sink up to 12 mA and include equivalent 30- resistors to reduce overshoot and undershoot.

The SN54ALVTH162244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH162244 is characterized for operation from -40°C to 85°C.

다운로드

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
1개 모두 보기
유형 직함 날짜
* Data sheet 2.5-V/3.3-V 16-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. E) 1999/01/08

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치