전력 관리 DC/DC 전력 모듈 벅 모듈(통합 인덕터)

TPS84610

활성

2.95V~6V 입력, 6A 동기형 벅, 통합 전원 솔루션

이 제품의 최신 버전이 있습니다

open-in-new 대안 비교
비교 대상 장치와 유사한 기능
TPSM82816 활성 선택적 주파수 동기화, 조정 가능한 소프트 시작 및 추적 기능을 갖춘 6V 6A 스텝다운 모듈 Smaller total BOM size of 60 mm² (saves >70% area) and 1% output voltage accuracy.
TPSM82866A 활성 통합 인덕터를 지원하는 2.4V~5.5V 입력 6A 스텝다운 전원 모듈 Alternative with 1.4-mm profile and 34-mm² total BOM size.

제품 상세 정보

Rating Catalog Topology Buck, Step-Down Converter, Synchronous Buck Iout (max) (A) 6 Vin (max) (V) 6 Vin (min) (V) 2.95 Vout (max) (V) 3.6 Vout (min) (V) 0.8 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Operating temperature range (°C) -40 to 125 Type Converter (Integrated Switch), DC/DC converter, Module Duty cycle (max) (%) 91 Control mode Voltage mode Switching frequency (min) (kHz) 400 Switching frequency (max) (kHz) 2000
Rating Catalog Topology Buck, Step-Down Converter, Synchronous Buck Iout (max) (A) 6 Vin (max) (V) 6 Vin (min) (V) 2.95 Vout (max) (V) 3.6 Vout (min) (V) 0.8 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Operating temperature range (°C) -40 to 125 Type Converter (Integrated Switch), DC/DC converter, Module Duty cycle (max) (%) 91 Control mode Voltage mode Switching frequency (min) (kHz) 400 Switching frequency (max) (kHz) 2000
B1QFN (RKG) 39 99 mm² 11 x 9
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
  • For Design Help Including SwitcherPro™ visit http://www.ti.com/TPS84610
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
  • For Design Help Including SwitcherPro™ visit http://www.ti.com/TPS84610

The TPS84610RKG is an easy-to-use integrated power solution that combines a 6-A DC/DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.

The TPS84610 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

The TPS84610RKG is an easy-to-use integrated power solution that combines a 6-A DC/DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.

The TPS84610 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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7개 모두 보기
유형 직함 날짜
* Data sheet TPS84610 2.95-V to 6-V Input, 6-A Synchronous Buck, IP Solution datasheet (Rev. B) 2018/04/11
Application note Soldering Requirements for BQFN Packages (Rev. C) 2020/03/05
Selection guide Power Management Guide 2018 (Rev. R) 2018/06/25
Application note AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A) 2013/04/23
More literature TPS84k Integrated Power Modules Info Card (Rev. A) 2012/08/28
More literature SEM1600 Topic 4: Constructing Your Power Supply – Layout Considerations 2005/07/12
Application note AN-643 EMI/RFI Board Design (Rev. B) 2004/05/03

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

LMZ30606EVM-003 — 2.95V~6V, 6A 스텝다운 전원 모듈 평가 보드

The LMZ30606EVM-003 is a fully assembled and tested circuit for evaluating the LMZ30606. The output voltage can be selected from four preset values using a jumper (3.3V, 2.5V, 1.8V, 1.2V, and 0.8V) and has an adjustable switching frequency of 500 kHz to 1 MHz. Solder pads and jumpers are available (...)
사용 설명서: PDF
TI.com에서 구매 불가
시뮬레이션 모델

TPS84610 TINA-TI Transient Reference Design

SLVM615.TSC (245 KB) - TINA-TI Reference Design
시뮬레이션 모델

TPS84610 TINA-TI Transient Spice Model

SLVM616.ZIP (67 KB) - TINA-TI Spice Model
시뮬레이션 모델

TPS84610 Unencrypted PSpice Transient Model Package (Rev. A)

SLVM552A.ZIP (52 KB) - PSpice Model
패키지 CAD 기호, 풋프린트 및 3D 모델
B1QFN (RKG) 39 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

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