전원 관리 DC/DC power modules Power modules (integrated inductor)

TPSM53602

활성

간단한 풋프린트를 지원하는 작은 5.5 x 5 x 4mm 개선된 HotRod™ QFN 패키지의 36V, 2A 스텝다운 전원 모듈

이 제품의 최신 버전이 있습니다

open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TPSM63602 활성 4mm x 6mm x 1.8mm 패키지에 들어 있는 3.6V~36V 입력, 1V~12V 출력, 2A 스텝다운 모듈 Next generation device, improved performance

제품 상세 정보

Iout (max) (A) 2 Vin (max) (V) 36 Vin (min) (V) 3.8 Vout (max) (V) 7 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Features EMI Tested, Enable, Light Load Efficiency, Power good Control mode current mode
Iout (max) (A) 2 Vin (max) (V) 36 Vin (min) (V) 3.8 Vout (max) (V) 7 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Features EMI Tested, Enable, Light Load Efficiency, Power good Control mode current mode
B3QFN (RDA) 15 27.5 mm² 5.5 x 5
  • Functional Safety-Capable
  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
    • 85-mm2 solution size (single sided)
    • Low EMI: meets CISPR11 radiated emissions
    • Excellent thermal performance: Up to 14 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603 and 4-A TPSM53604
  • Create a custom design using the TPSM53602 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design
  • Functional Safety-Capable
  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
    • 85-mm2 solution size (single sided)
    • Low EMI: meets CISPR11 radiated emissions
    • Excellent thermal performance: Up to 14 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603 and 4-A TPSM53604
  • Create a custom design using the TPSM53602 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design

The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.

The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.

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기술 문서

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모두 보기5
유형 직함 날짜
* Data sheet TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. B) PDF | HTML 2021/09/30
Functional safety information TPSM53602 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA PDF | HTML 2021/08/24
Application note Soldering Requirements for BQFN Packages (Rev. C) 2020/03/05
EVM User's guide Using the TPSM53604EVM, TPSM53603EVM, and TPSM53602EVM (Rev. B) 2019/12/13
White paper Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging 2019/11/19

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TPSM53602EVM — 소형 패키지의 3.8V~36V, 2A 스텝다운 전원 모듈 평가 보드

The TPSM53602 evaluation board (EVM) is configured to evaluate the operation of the TPSM53602 power module for current up to 2 A. The input voltage range is 3.8 V to 36 V. The output voltage range is 1 V to 7 V. The evaluation board makes it easy to evaluate the TPSM53602 operation.
사용 설명서: PDF
TI.com에서 구매할 수 없습니다
시뮬레이션 모델

TPSM53602 PSpice Transient Model

SNVMC58.ZIP (402 KB) - PSpice Model
설계 툴

SNVR487 TPSM53602 EVM Design Files

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Power modules (integrated inductor)
TPSM53602 간단한 풋프린트를 지원하는 작은 5.5 x 5 x 4mm 개선된 HotRod™ QFN 패키지의 36V, 2A 스텝다운 전원 모듈
하드웨어 개발
평가 보드
TPSM53602EVM 소형 패키지의 3.8V~36V, 2A 스텝다운 전원 모듈 평가 보드
패키지 다운로드
B3QFN (RDA) 15 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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