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CSD96371Q5M

現行

產品詳細資料

Rating Catalog VDS (V) 25 Ploss current (A) 25 Features Ultra-low inductance package Operating temperature range (°C) -55 to 150
Rating Catalog VDS (V) 25 Ploss current (A) 25 Features Ultra-low inductance package Operating temperature range (°C) -55 to 150
LSON-CLIP (DQP) 22 30 mm² (6 mm × 5 mm)
  • 92% System Efficiency at 30A
  • High Frequency Operation (Up To 2MHz)
  • High Density – SON 5-mm × 6-mm Footprint
  • Low Power Loss 3.4W at 30A
  • Ultra Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3V and 5V PWM Signal Compatible
  • 3-State PWM Input
  • Integrated Bootstrap Diode
  • Pre-Bias Start-Up Protection
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating Halogen Free
  • 92% System Efficiency at 30A
  • High Frequency Operation (Up To 2MHz)
  • High Density – SON 5-mm × 6-mm Footprint
  • Low Power Loss 3.4W at 30A
  • Ultra Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3V and 5V PWM Signal Compatible
  • 3-State PWM Input
  • Integrated Bootstrap Diode
  • Pre-Bias Start-Up Protection
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating Halogen Free

The CSD96371Q5M NexFET Power Stage has an optimized design for use in a high power high density Synchronous Buck converter. This product integrates the gate driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high current, high efficiency, and high speed switching capability in a small 5-mm × 6-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD96371Q5M NexFET Power Stage has an optimized design for use in a high power high density Synchronous Buck converter. This product integrates the gate driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high current, high efficiency, and high speed switching capability in a small 5-mm × 6-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 Synchronous Buck NexFET Power Stage - CSD96371Q5M datasheet 2012/12/5
選擇指南 Power Management Guide 2018 (Rev. R) 2018/6/25

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封裝 針腳 CAD 符號、佔位空間與 3D 模型
LSON-CLIP (DQP) 22 Ultra Librarian

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