TLV342
- 1.8V and 5V performance
- Low offset (A grade)
- 1.25mV maximum (25°C)
- 1.7mV maximum (–40°C to 125°C)
- Rail-to-rail output swing
- Wide common-mode input voltage range: –0.2V to (V+ – 0.5V)
- Input bias current: 1pA (typical)
- Input offset voltage: 0.3mV (typical)
- Low supply current: 70µA/channel
- Low shutdown current: 10pA (typical) per channel
- Gain bandwidth: 2.3MHz (typical)
- Slew rate: 0.9V/µs (typical)
- Turnon time from shutdown: 5µs (typical)
- Input referred voltage noise (at 10kHz): 20nV/√ Hz
- ESD protection exceeds JESD 22:
- 2000V Human-Body Model (HBM)
- 750V Charged-device model (CDM)
The TLV34xx devices are single and dual CMOS operational amplifiers, respectively, with low-voltage, low-power, and rail-to-rail output swing capabilities. The PMOS input stage offers an ultra-low input bias current of 1pA (typical) and an offset voltage of 0.3mV (typical). For applications requiring excellent dc precision, the A grade (TLV34xA) has a low offset voltage of 1.25mV (maximum) at 25°C.
These single-supply amplifiers are designed specifically for ultra-low-voltage (1.5V to 5V) operation, with a common-mode input voltage range that typically extends from –0.2V to 0.5V from the positive supply rail.
The TLV341 (single) and TLV342 (dual) in the RUG package also offer a shutdown (SHDN) pin that can be used to disable the device. In shutdown mode, the supply current is reduced to 45pA (typical). Offered in both the SOT-23 and smaller SC70 packages, the TLV341 is an excellent choice for the most space-constrained applications. The dual TLV342 is offered in the standard SOIC, VSSOP, and X2QFN packages.
An extended industrial temperature range from –40°C to 125°C makes the TLV34xx flexible for use in a wide variety of commercial and industrial applications.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TLV34xx Low-Voltage Rail-to-Rail Output CMOS Operational Amplifiers With Shutdown datasheet (Rev. E) | PDF | HTML | 2025年 6月 30日 |
| Application note | Op Amp ESD Protection Structures (Rev. A) | PDF | HTML | 2023年 1月 24日 | |
| User guide | SMALL-AMP-DIP Evaluation Module (EVM) (Rev. A) | 2021年 7月 30日 | ||
| Application note | Conditioning a Switch-mode Power Supply Current Signal Using TI Op Amps (Rev. A) | PDF | HTML | 2021年 6月 11日 | |
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
| Application note | Use of Rail-to-Rail Operational Amplifiers (Rev. A) | 1999年 12月 22日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
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Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
SMALL-AMP-DIP-EVM — 適用於採用小尺寸封裝之運算放大器的評估模組
SMALL-AMP-DIP-EVM 提供快速簡易方式,與許多業界標準小型封裝進行介接,因而加速小型封裝運算放大器原型設計。SMALL-AMP-DIP-EVM 支援八個小型封裝選項,包括 DPW-5 (X2SON)、DSG-8 (WSON)、DCN-8 (SOT)、DDF-8 (SOT)、RUG-10 (X2QFN)、RUC-14 (X2QFN)、RGY-14 (VQFN) 和 RTE-16 (WQFN)。
ANALOG-ENGINEER-CALC — 類比工程師計算機
除了作為獨立工具使用外,此計算機還與類比工程師口袋參考中描述的概念相得益彰。
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
| VSSOP (DGK) | 8 | Ultra Librarian |
| X2QFN (RUG) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點