SLUSCK1C July 2016 – June 2018 TPS546C20A
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
Proper mounting technique adequately covers the exposed thermal pad with solder. Excessive heat during the reflow process can affect electrical performance. Figure 53 shows the recommended reflow-oven thermal profile. Proper post-assembly cleaning is also critical to device performance. Refer to QFN/SON PCB Attachment (SLUA271) for more information.
PARAMETER | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
RAMP UP AND RAMP DOWN | |||||
rRAMP(up) | Average ramp-up rate, TS(max) to TP | 3 | °C/s | ||
rRAMP(down) | Average ramp-down rate, TP to TS(max) | 6 | °C/s | ||
PRE-HEAT | |||||
TS | Preheat temperature | 150 | 200 | °C | |
tS | Preheat time, TS(min) to TS(max) | 60 | 180 | s | |
REFLOW | |||||
TL | Liquidus temperature | 217 | °C | ||
TP | Peak temperature | 260 | °C | ||
tL | Time maintained above liquidus temperature, TL | 60 | 150 | s | |
tP | Time maintained within 5°C of peak temperature, TP | 20 | 40 | s | |
t25P | Total time from 25°C to peak temperature, TP | 480 | s |