1 Introduction

In the stage of customer R&D and mass production, it is inevitable to encounter many hardware or software related problems, when the customer suspects that a problem is related to the internal module of the chip, customer need contact with your support window first, because TI have high confidence to our device quality, most issue high possibility related customer’s hardware or software design. In most cases, TI can help you solve the problem, so there is no need to return your device.

In some special corner cases that customer really need to return customer device, it is necessary to judge whether your chip meets our return analysis standard according to TI's general CRP standard. The above is the standard process for returning TI problematic devices that should be read first before you submit your request to TI. You need to fill in and submit the corresponding CRP request form in the system. At this time, the system will automatically assign the corresponding TI FQE colleagues to follow up.

In addition to the standard return process, customer is required to assist TI in some experiments or further analysis in customer system level to locate the specific module failure, including but not limited to ABA experiments, X-ray solder joint photos, TI default software testing, signal waveform measurement, and so forth. These experiments need to be implemented case by case. Processor is so complex and difficult to analysis, so need strong cooperation from customers. This helps accelerate the process of this device analysis.

Over all, Jacinto7 devices need to follow Figure 1-1 to move on the process. TI support window will help if you have any question.