SLASFL3 September   2026 DAC90802

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
      1. 5.8.1 Typical Characteristics: Linearity
      2. 5.8.2 Typical Characteristics: Glitch
      3. 5.8.3 Typical Characteristics: Multiplying Mode
      4. 5.8.4 Typical Characteristics: Fast-Settling Mode
      5. 5.8.5 Typical Characteristics: AWG Mode
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converters
        1. 6.3.1.1 Reference
        2. 6.3.1.2 Output Span
          1. 6.3.1.2.1 Gain Overrange
        3. 6.3.1.3 Output Synchronization
        4. 6.3.1.4 Thermal Sensors
      2. 6.3.2 Power-On
      3. 6.3.3 Serial Data Interface
        1. 6.3.3.1 SPI Configurations
        2. 6.3.3.2 SPI Stream Mode
        3. 6.3.3.3 SPI Daisy Chain Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 AWG Mode
      2. 6.4.2 Fast Settling Mode
      3. 6.4.3 Multiplying Mode
  8. 7 Register Maps
    1. 7.1 COMMON Registers
    2. 7.2 HS_DATA Registers
    3. 7.3 HR_DATA Registers
  9. 8 Application and Implementation
    1. 8.1 Application
    2. 8.2 Design Requirements
      1. 8.2.1 Reference Signal Chain Information
        1. 8.2.1.1 DC Reference
        2. 8.2.1.2 AC Reference
      2. 8.2.2 Optimising the Self-Heating Trim to Achieve Lowest THD Across Frequencies for High Voltage Swing
      3. 8.2.3 Digital Interface
      4. 8.2.4 Grounding Recommendations
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Recommendation
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

1 Features

  • INL: 1.9ppm (±0.5LSB at 18 bits)
  • DNL: 1.9ppm (±0.5LSB at 18 bits)
  • VREF range: ±21V
  • Integrated ±21V output buffer with high slew rate
  • Digitally controlled gain options: 1 ×, 2 ×, and 4 ×
  • 50ns settling to 0.1%FSR with 140pVs glitch
  • Reference multiplying bandwidth: 25MHz, MFE −90dB at 100kHz
  • THD at ±5V output: −125dB (2kHz) and −110dB (100kHz)
  • QSPI™-compatible interface: 33MUPS in 16-bit high-speed mode at 66MHz DDR
  • Double-buffered registers with per-channel LDAC pins
  • Internal power on reset
  • Separate 4Q multiplying, Kelvin-connected reference inputs
  • Integrated ground buffer