SLAU278AH May 2009 – March 2021
Figure 4-59 MSP-TS430PN80 Target Socket Module, PCB| Pos. | Ref Des | No. per Board | Description | Digi-Key Part No. | Comment |
|---|---|---|---|---|---|
| 1 | C1, C2 | 0 | 12pF, SMD0805 | DNP: C1, C2 | |
| 1.1 | C3, C4 | 0 | 47pF, SMD0805 | DNP: Only recommendation. Check your crystal spec. | |
| 2 | C6, C7 | 1 | 10uF, 10V, Tantal Size B | 511-1463-2-ND | |
| 3 | C5 | 1 | 100nF, SMD0805 | 478-3351-2-ND | |
| 4 | C8 | 1 | 10nF, SMD0805 | 478-1383-2-ND | |
| 5 | D1 | 1 | green LED, SMD0603 | 475-1056-2-ND | |
| 6 | J1, J2, J3, J4 | 0 | 25-pin header, TH | DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. | |
| SAM1029-20-ND | : Header | ||||
| SAM1213-20-ND | : Receptacle | ||||
| 7 | J5, JP1 | 2 | 3-pin header, male, TH | SAM1035-03-ND | |
| 8 | J6, JP2 | 2 | 2-pin header, male, TH | SAM1035-02-ND | Place jumper on header |
| 9 | 3 | Jumper | 15-38-1024-ND | Place on: J6, JP2, JP1/Pos1-2 | |
| 10 | JTAG | 1 | 14-pin connector, male, TH | HRP14H-ND | |
| 11 | BOOTST | 0 | 10-pin connector, male, TH | DNP: Keep vias free of solder | |
| 12 | Q1, Q2 | 0 | Crystal | Q1: Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF | DNP: Keep vias free of solder |
| 13 | R3 | 1 | 560 Ω, SMD0805 | 541-560ATR-ND | |
| 14 | R1, R2, R4, R6, R7, R10, R11, R12 | 2 | 0 Ω, SMD0805 | 541-000ATR-ND | DNP: R4, R6, R7, R10, R11, R12 |
| 15 | R5 | 1 | 47k Ω, SMD0805 | 541-47000ATR-ND | |
| 16 | U1 | 1 | Socket: IC201-0804-014 | Manuf.: Yamaichi | |
| 17 | PCB | 1 | 77 x 77 mm | 2 layers | |
| 18 | Adhesive Plastic feet | 4 | ~6mm width, 2mm height | for example, 3M Bumpons Part No. SJ-5302 | Apply to corners at bottom side |
| 19 | MSP430 | 2 | MSP430FG439IPN | DNP: Enclosed with kit supplied by TI |