SLLA305A May   2010  – September 2023 ESD441 , TPD12S015 , TPD12S015A , TPD12S016 , TPD12S520 , TPD12S521 , TPD13S523 , TPD1E05U06 , TPD1E10B06 , TPD1E10B09 , TPD1E6B06 , TPD1S414 , TPD1S514 , TPD2E001 , TPD2E001-Q1 , TPD2E009 , TPD2E1B06 , TPD2E2U06 , TPD2E2U06-Q1 , TPD2EUSB30 , TPD2EUSB30A , TPD2S017 , TPD3F303 , TPD3S014 , TPD3S044 , TPD4E001 , TPD4E001-Q1 , TPD4E004 , TPD4E02B04 , TPD4E05U06 , TPD4E05U06-Q1 , TPD4E101 , TPD4E1B06 , TPD4E1U06 , TPD4E6B06 , TPD4EUSB30 , TPD4S010 , TPD4S012 , TPD4S014 , TPD4S1394 , TPD4S214 , TPD5E003 , TPD5S115 , TPD5S116 , TPD6E001 , TPD6E004 , TPD6E05U06 , TPD6F002 , TPD6F002-Q1 , TPD6F003 , TPD7S019 , TPD8E003 , TPD8F003 , TPD8S009

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Device Summary
  6. 3Pin Configuration and Functions
  7. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings - JEDEC
    3. 4.3 ESD Ratings - AEC
    4. 4.4 ESD Ratings - IEC
    5. 4.5 ESD Ratings - ISO
    6. 4.6 Recommended Operating Conditions
    7. 4.7 Thermal Information
    8. 4.8 Electrical Characteristics
      1. 4.8.1 Reverse Standoff Voltage (VRWM)
      2. 4.8.2 Breakdown Voltage (VBR)
      3. 4.8.3 Leakage Current (ILEAK)
      4. 4.8.4 Dynamic Resistance (RDYN)
      5. 4.8.5 Line Capacitance (CL)
      6. 4.8.6 Clamping Voltage (VCLAMP)
    9. 4.9 Typical Characteristics
      1. 4.9.1 TLP Plot
      2. 4.9.2 ± 8kV Clamped IEC Waveform
      3. 4.9.3 Capacitance vs. Bias Voltage
      4. 4.9.4 Leakage Current vs. Temperature
      5. 4.9.5 Capacitance vs. Temperature
      6. 4.9.6 Insertion Loss
  8. 5Summary
  9. 6References
  10. 7Revision History

4.7 Thermal Information

Thermal information is standard in the majority of TI device data sheets. An example of a table that is found in most ESD protection device data sheets is shown in Table 4-8. The most commonly reported metric is the junction to ambient thermal resistance, RθJA. This metric measures the thermal performance of an IC package mounted on a specific test coupon and is intended to be used to compare the thermal performance of a package for a TI part to other companies. For more detail into the specifics of each thermal metric, refer to the application note Semiconductor and IC Package Thermal Metrics.

Table 4-8 Thermal Information Example
THERMAL METRICESD451UNIT
DPL (X2SON)
2 PINS
RθJAJunction-to-ambient thermal resistance 356.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance201.2°C/W
RθJBJunction-to-board thermal resistance 136.4°C/W
ψJTJunction-to-top characterization parameter 2.6°C/W
ψJBJunction-to-board characterization parameter 135.9°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance NA°C/W