Quad 0.8-pF, 5.5-V, ±8-kV ESD protection diode with with VCC pin for High Speed Interfaces
Product details
Parameters
Package | Pins | Size
Features
- IEC 61000-4-2 ESD Protection
- ±8-kV IEC 61000-4-2 Contact Discharge
- ±12-kV IEC 61000-4-2 Air-Gap Discharge
- ANSI/ESDA/JEDEC JS-001
- ±15-kV Human Body Model (HBM)
- Low 1.6-pF Input Capacitance
- 0.9-V to 5.5-V Supply Voltage Range
- 4-Channel Device
- Space-Saving SON (DRY) Package
Description
The TPD4E004 is a low-capacitance transient voltage suppression (TVS) device. TPD4E004 is designed to protect sensitive electronics attached to communication lines from electrostatic discharge (ESD). Each of the four channels consists of a pair of diodes that steer ESD current pulses to VCC or GND. The TPD4E004 protects against ESD pulses up to ±15-kV Human-Body Model (HBM) and, as specified in IEC 61000-4-2, ±8-kV contact discharge and ±12-kV air-gap Discharge. This device has 1.6-pF of capacitance per channel, making it ideal for use in high-speed data IO interfaces.
The TPD4E004 is a quad-ESD structure designed for USB, ethernet, and other high-speed applications.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TPD4E004 4-Channel ESD-Protection Array For High-Speed Data Interfaces datasheet (Rev. B) | Jan. 22, 2016 |
Application note | ESD Packaging and Layout Guide | Aug. 27, 2020 | |
Technical articles | Benefits of using Sub-1 GHz connectivity for grid asset monitoring, protection and control | May 28, 2020 | |
User guide | Generic ESD Evaluation Module User's Guide | Apr. 03, 2018 | |
Selection guide | System-Level ESD Protection Guide (Rev. C) | Feb. 20, 2018 | |
Technical articles | Trends in building automation: connected sensors for user comfort | Sep. 02, 2016 | |
White paper | Designing USB for short-to-battery tolerance in automotive environments | Feb. 10, 2016 | |
Application note | ESD Layout Guide | Mar. 04, 2015 | |
Application note | Design Considerations for System-Level ESD Circuit Protection | Sep. 25, 2012 | |
Application note | Reading and Understanding an ESD Protection Datasheet | May 19, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
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The standard 20-pin BoosterPack (...)
Features
- Onboard antenna enables field testing
- Standard interface for DCA1000 connectivity and MMWAVE-STUDIO for raw data capture
- TI LaunchPad development-kit interface to seamlessly connect to TI MCUs
Description
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Features
- 5V input to +/-100V Differential Output
- Single ended and differential input modes
- Multiple boost voltage settings
- Easily powered through USB or external Power Supply
- Breakout for usage as a boost converter
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Features
- H-bridge smart gate driver EVM for automotive applications
- Temperature grade 1: –40°C to +125°C, TA
- 4.9-V to 37-V operating range
- Doubler charge pump for 100% PWM
- Half-bridge and H-bridge control modes
- SPI interface for detailed configuration and diagnostics
- Smart gate drive architecture
- Adjustable slew (...)
Description
Features
- Allows testing of most TI ESD devices
- Many footprints to allow testing of each part
- S-parameter testing for signal integrity
Description
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Features
- Multiple board perforations provide maximum evaluation and system design flexibility
- EVM does not require additional components for operation, enabling rapid device evaluation
- Accompanying GUI for quick concept demonstration and data capture
Description
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Features
- Onboard antenna to enable field testing
- XDS110-based JTAG with serial port interface for flash programming
- UART-to-USB interface for control, configuration, and data visualization
- TI LaunchPad interface to seamlessly connect to TI MCUs
- CAN connector enables direct interface to car units
Description
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Features
- LaunchPad kit with a 433 MHz and Bluetooth low energy radio for wireless applications with integrated PCB trace antenna
- Access all I/O signals with the BoosterPack™ plug-in module connectors
- On-board emulator to get started with instant code development in CCS Cloud
- Can be used with both LaunchPad kit (...)
Description
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The LMK61E2EVM can be (...)
Features
- Ultra low jitter differential clock generation
- Powered over USB or externally (SMA connector)
- Onboard USB to I2C interface
- Coarse and Fine Frequency margining
- GUI platform for full access to LMK03328 registers and EEPROM
Description
Features
- Provides GUI for simple and fast setup
- Perforated PCB allows sensor to be placed in user’s system
- Up to 0.1°C accuracy with 0.0078°C resolution (16-bit)
Description
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Features
- SimpleLInk MSP432P4111 32-bit Arm Cortex M4F MCU
- 40 pin LaunchPad standard leveraging the BoosterPack ecosystem
- On-Board XDS-110 emulator featuring EnergyTrace+ technology
- On-Board Segmented LCD Display
- 2 user buttons and 2 LEDs for user interaction
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Reference designs
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SON (DRY) | 6 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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