SLVSIM8A June   2025  – December 2025 DRV8363-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Functions 48-Pin DRV8363-Q1
  6. 5 Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information 1pkg
    4. 5.4 Electrical Characteristics
    5. 5.5 SPI Timing Requirements
    6. 5.6 SPI Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Three BLDC Gate Drivers
        1. 6.3.1.1 PWM Control Modes
          1. 6.3.1.1.1 6x PWM Mode
          2. 6.3.1.1.2 3x PWM Mode with INLx enable control
          3. 6.3.1.1.3 1x PWM Mode
        2. 6.3.1.2 Gate Drive Architecture
          1. 6.3.1.2.1 Bootstrap diode
          2. 6.3.1.2.2 VCP Trickle Charge pump
          3. 6.3.1.2.3 Gate Driver Output
          4. 6.3.1.2.4 Passive and Semi-active pull-down resistor
          5. 6.3.1.2.5 TDRIVE/IDRIVE Gate Drive Timing Control
          6. 6.3.1.2.6 Propagation Delay
          7. 6.3.1.2.7 Deadtime and Cross-Conduction Prevention
      2. 6.3.2 DVDD Linear Voltage Regulator
      3. 6.3.3 Low-Side Current Sense Amplifiers
        1. 6.3.3.1 Unidirectional Current Sense Operation
        2. 6.3.3.2 Bidirectional Current Sense Operation
      4. 6.3.4 Gate Driver Shutdown
        1. 6.3.4.1 DRVOFF Gate Driver Shutdown
        2. 6.3.4.2 Soft Shutdown Timing Sequence
      5. 6.3.5 Active Short Circuit
      6. 6.3.6 Gate Driver Protective Circuits
        1. 6.3.6.1  GVDD Undervoltage Lockout (GVDD_UV)
        2. 6.3.6.2  GVDD Overvoltage Fault (GVDD_OV)
        3. 6.3.6.3  VDRAIN Undervoltage Fault (VDRAIN_UV)
        4. 6.3.6.4  VDRAIN Overvoltage Fault (VDRAIN_OV)
        5. 6.3.6.5  VCP Undervoltage Fault (CP_OV)
        6. 6.3.6.6  BST Undervoltage Lockout (BST_UV)
        7. 6.3.6.7  MOSFET VDS Overcurrent Protection (VDS_OCP)
        8. 6.3.6.8  MOSFET VGS Monitoring Protection
        9. 6.3.6.9  Shunt Overcurrent Protection (SNS_OCP)
        10. 6.3.6.10 Thermal Shutdown (OTSD)
        11. 6.3.6.11 Thermal Warning (OTW)
        12. 6.3.6.12 OTP CRC
        13. 6.3.6.13 SPI Watchdog Timer
        14. 6.3.6.14 Phase Diagnostic
    4. 6.4 Fault Detection and Response Summary Table (Fault Table)
    5. 6.5 Device Functional Modes
      1. 6.5.1 Gate Driver Functional Modes
        1. 6.5.1.1 Sleep Mode
        2. 6.5.1.2 Standby Mode
        3. 6.5.1.3 Active Mode
    6. 6.6 Programming
      1. 6.6.1 SPI
      2. 6.6.2 SPI Format
      3. 6.6.3 SPI Format Diagrams
    7. 6.7 Register Maps
      1. 6.7.1 STATUS Registers
      2. 6.7.2 CONTROL Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application with 48-pin package
        1. 7.2.1.1 External Components
      2. 7.2.2 Application Curves
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 10.1 Tape and Reel Information

Abstract

PACKAGING INFORMATION

Orderable part number Status
(1)		 Material
type
(2)		 Package | Pins Package qty | Carrier RoHS
(3)		 Lead finish/Ball material
(4)		 MSL rating/Peak reflow
(5)		 Op temp (°C) Part marking
(6)
DRV8363RGZR  Active Preproduction VQFN (RGZ) | 48 1000 | TRAY Yes NiPdAu Level-3-260C-168 HR -40 to 125 DRV8363
(1) Status: For more details on status, see our product life cycle.
(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.
(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.