SLVSIM8A June   2025  – December 2025 DRV8363-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Functions 48-Pin DRV8363-Q1
  6. Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information 1pkg
    4. 5.4 Electrical Characteristics
    5. 5.5 SPI Timing Requirements
    6. 5.6 SPI Timing Diagrams
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Three BLDC Gate Drivers
        1. 6.3.1.1 PWM Control Modes
          1. 6.3.1.1.1 6x PWM Mode
          2. 6.3.1.1.2 3x PWM Mode with INLx enable control
          3. 6.3.1.1.3 1x PWM Mode
        2. 6.3.1.2 Gate Drive Architecture
          1. 6.3.1.2.1 Bootstrap diode
          2. 6.3.1.2.2 VCP Trickle Charge pump
          3. 6.3.1.2.3 Gate Driver Output
          4. 6.3.1.2.4 Passive and Semi-active pull-down resistor
          5. 6.3.1.2.5 TDRIVE/IDRIVE Gate Drive Timing Control
          6. 6.3.1.2.6 Propagation Delay
          7. 6.3.1.2.7 Deadtime and Cross-Conduction Prevention
      2. 6.3.2 DVDD Linear Voltage Regulator
      3. 6.3.3 Low-Side Current Sense Amplifiers
        1. 6.3.3.1 Unidirectional Current Sense Operation
        2. 6.3.3.2 Bidirectional Current Sense Operation
      4. 6.3.4 Gate Driver Shutdown
        1. 6.3.4.1 DRVOFF Gate Driver Shutdown
        2. 6.3.4.2 Soft Shutdown Timing Sequence
      5. 6.3.5 Active Short Circuit
      6. 6.3.6 Gate Driver Protective Circuits
        1. 6.3.6.1  GVDD Undervoltage Lockout (GVDD_UV)
        2. 6.3.6.2  GVDD Overvoltage Fault (GVDD_OV)
        3. 6.3.6.3  VDRAIN Undervoltage Fault (VDRAIN_UV)
        4. 6.3.6.4  VDRAIN Overvoltage Fault (VDRAIN_OV)
        5. 6.3.6.5  VCP Undervoltage Fault (CP_OV)
        6. 6.3.6.6  BST Undervoltage Lockout (BST_UV)
        7. 6.3.6.7  MOSFET VDS Overcurrent Protection (VDS_OCP)
        8. 6.3.6.8  MOSFET VGS Monitoring Protection
        9. 6.3.6.9  Shunt Overcurrent Protection (SNS_OCP)
        10. 6.3.6.10 Thermal Shutdown (OTSD)
        11. 6.3.6.11 Thermal Warning (OTW)
        12. 6.3.6.12 OTP CRC
        13. 6.3.6.13 SPI Watchdog Timer
        14. 6.3.6.14 Phase Diagnostic
    4. 6.4 Fault Detection and Response Summary Table (Fault Table)
    5. 6.5 Device Functional Modes
      1. 6.5.1 Gate Driver Functional Modes
        1. 6.5.1.1 Sleep Mode
        2. 6.5.1.2 Standby Mode
        3. 6.5.1.3 Active Mode
    6. 6.6 Programming
      1. 6.6.1 SPI
      2. 6.6.2 SPI Format
      3. 6.6.3 SPI Format Diagrams
    7. 6.7 Register Maps
      1. 6.7.1 STATUS Registers
      2. 6.7.2 CONTROL Registers
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application with 48-pin package
        1. 7.2.1.1 External Components
      2. 7.2.2 Application Curves
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 10.1 Tape and Reel Information

SPI

The device uses a serial peripheral interface (SPI) bus to set device configurations, operating parameters, and read out diagnostic information. The device SPI operates in secondary mode and connects to an external controller. If SPI CRC (SPI_CRC_EN = 0b) is enabled, the SPI input data (SDI) word consists of a 24 bit word, with one read/write bit, one parity bit, 6-bit address, and 16 bits of data. The SPI output data (SDO) word consists of a 24 bit word, with an 8-bit status data, and 16 bits of register data. If SPI CRC is enabled (SPI_CRC_EN = 1b), an additional 8 bit CRC (initial value 0xFF, polynomial 0x2F) is added to the end of the frame, increasing the total SPI data word length to 32 bits.

A valid frame must meet the following conditions:

  • The SCLK pin is low when the nSCS pin transitions from high to low and from low to high.
  • The nSCS pin is pulled high for at least 400ns between words.
  • When the nSCS pin is pulled high, any signals at the SCLK and SDI pins are ignored and the SDO pin is set Hi-Z.
  • Data is captured on the falling edge of SCLK and data is propagated on the rising edge of SCLK.
  • The most significant bit (MSB) is shifted in and out first.
  • A full 24 (or 32) SCLK cycles must occur for transaction to be valid.
  • If the data word sent to the SDI pin is not 24 (or 32) bits, a frame error occurs and the data word is ignored.
  • For a write command, the existing data in the register being written to is shifted out on the SDO pin following the 8 bit command data.
  • The SDO pin is a push-pull type output.
  • The SPI fault is confirmed at the rising edge of nSCS.