SLVSL35
September 2026
TUSB2514B
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Timing Requirements
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Battery Charging Features
6.3.2
USB Power Management
6.3.3
Clock Generation
6.3.3.1
Crystal Requirements
6.3.3.2
Input Clock Requirements
6.3.4
Power-Up and Reset
6.4
Device Functional Modes
6.4.1
I2C EEPROM Operation
6.4.2
SMBus Target Operation
6.4.3
Port Configuration
7
Register Maps
7.1
TUSB2514 Registers
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Application Curves
8.3
Power Supply Recommendations
8.3.1
TUSB2514B Power Supply
8.3.2
Downstream Port Power
8.3.3
Ground
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
Placement
8.4.1.2
Package Specific
8.4.1.3
Differential Pairs
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
1
Features
Compliant to USB Specification Rev. 2.0
Single 3.3V power supply
Hi-Speed USB 2.0 hub with 4 downstream ports
Multi Transaction Translator (MTT)
Full power management with per-port or ganged power switching and overcurrent detection
Supports USB Battery Charging specification Rev. 1.2
Integrated USB termination and pull-up/pull-down resistors
I
2
C EEPROM or SMBus target interface for device configuration:
Vendor ID and Product ID
USB polarity swap
Downstream port configuration
Secure for enterprise operations
Hardware-based state machine eliminates firmware injection risks via MCU-free operation
24MHz crystal or oscillator clock input
Extended 105°C maximum ambient temperature range for datacenter applications