SLVSL35
September 2026
TUSB2514B
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Timing Requirements
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Battery Charging Features
6.3.2
USB Power Management
6.3.3
Clock Generation
6.3.3.1
Crystal Requirements
6.3.3.2
Input Clock Requirements
6.3.4
Power-Up and Reset
6.4
Device Functional Modes
6.4.1
I2C EEPROM Operation
6.4.2
SMBus Target Operation
6.4.3
Port Configuration
7
Register Maps
7.1
TUSB2514 Registers
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Application Curves
8.3
Power Supply Recommendations
8.3.1
TUSB2514B Power Supply
8.3.2
Downstream Port Power
8.3.3
Ground
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
Placement
8.4.1.2
Package Specific
8.4.1.3
Differential Pairs
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
5.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±2000
V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins
(2)
±500
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.