SLVSL35 September   2026 TUSB2514B

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Battery Charging Features
      2. 6.3.2 USB Power Management
      3. 6.3.3 Clock Generation
        1. 6.3.3.1 Crystal Requirements
        2. 6.3.3.2 Input Clock Requirements
      4. 6.3.4 Power-Up and Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 I2C EEPROM Operation
      2. 6.4.2 SMBus Target Operation
      3. 6.4.3 Port Configuration
  8. 7 Register Maps
    1. 7.1 TUSB2514 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 TUSB2514B Power Supply
      2. 8.3.2 Downstream Port Power
      3. 8.3.3 Ground
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Placement
        2. 8.4.1.2 Package Specific
        3. 8.4.1.3 Differential Pairs
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Clock Generation

The TUSB2514B accepts a 24MHz crystal input or an external clock source to drive an internal oscillator. If a clock is provided to XI instead of a crystal, XO is left open. Otherwise, if a crystal is used, the connection must follow the guidelines below. The XI and XO are coupled to other leads and supplies on the PCB. Keep the XI and XO as short as possible and away from any switching leads. TI also recommends minimizing the capacitance between XI and XO by shielding CL1 and CL2 with the clean ground lines.

TUSB2514B TUSB2514B Crystal Oscillator Circuit

Figure 6-2 TUSB2514B Crystal Oscillator Circuit