SLVSL35 September   2026 TUSB2514B

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Battery Charging Features
      2. 6.3.2 USB Power Management
      3. 6.3.3 Clock Generation
        1. 6.3.3.1 Crystal Requirements
        2. 6.3.3.2 Input Clock Requirements
      4. 6.3.4 Power-Up and Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 I2C EEPROM Operation
      2. 6.4.2 SMBus Target Operation
      3. 6.4.3 Port Configuration
  8. 7 Register Maps
    1. 7.1 TUSB2514 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 TUSB2514B Power Supply
      2. 8.3.2 Downstream Port Power
      3. 8.3.3 Ground
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Placement
        2. 8.4.1.2 Package Specific
        3. 8.4.1.3 Differential Pairs
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.4.1.1 Placement

  • Place a 9.53-kΩ ±1% resistor connected to pin USB_R1 as close as possible to the TUSB2514B device.
  • Place a 0.1-µF capacitor as close as possible on each VDD and VDD33 power pin.
  • Place the ESD and EMI protection devices (if used) as close as possible to the USB connector.
  • If a crystal is used, place the crystal as close as possible to the XI and XO pins of the TUSB2514B device.
  • Place voltage regulators as far away as possible from the TUSB2514B device, the crystal, and the differential pairs.
  • In general, place the large bulk capacitors associated with each power rail as close as possible to the voltage regulators.