SLVSL35 September   2026 TUSB2514B

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Battery Charging Features
      2. 6.3.2 USB Power Management
      3. 6.3.3 Clock Generation
        1. 6.3.3.1 Crystal Requirements
        2. 6.3.3.2 Input Clock Requirements
      4. 6.3.4 Power-Up and Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 I2C EEPROM Operation
      2. 6.4.2 SMBus Target Operation
      3. 6.4.3 Port Configuration
  8. 7 Register Maps
    1. 7.1 TUSB2514 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 TUSB2514B Power Supply
      2. 8.3.2 Downstream Port Power
      3. 8.3.3 Ground
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Placement
        2. 8.4.1.2 Package Specific
        3. 8.4.1.3 Differential Pairs
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.4.1.2 Package Specific

  • The TUSB2514B device package has a 0.5mm pin pitch.
  • The TUSB2514B device package has a thermal pad. This thermal pad must be connected to ground through a system of vias.
  • Solder mask all vias under device, except for those connected to the thermal pad, to avoid any potential issues with thermal pad layouts.