SLVSL35 September   2026 TUSB2514B

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Battery Charging Features
      2. 6.3.2 USB Power Management
      3. 6.3.3 Clock Generation
        1. 6.3.3.1 Crystal Requirements
        2. 6.3.3.2 Input Clock Requirements
      4. 6.3.4 Power-Up and Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 I2C EEPROM Operation
      2. 6.4.2 SMBus Target Operation
      3. 6.4.3 Port Configuration
  8. 7 Register Maps
    1. 7.1 TUSB2514 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 TUSB2514B Power Supply
      2. 8.3.2 Downstream Port Power
      3. 8.3.3 Ground
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Placement
        2. 8.4.1.2 Package Specific
        3. 8.4.1.3 Differential Pairs
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TUSB2514B UNIT
RHH
36 PINS
RθJA Junction-to-ambient thermal resistance 28.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.8 °C/W
RθJB Junction-to-board thermal resistance 10.2 °C/W
ΨJT Junction-to-top characterization parameter 0.2 °C/W
ΨJB Junction-to-board characterization parameter 10.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.