SNVSCB5B March   2022  – May 2025 TPS388R0-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I2C
      2. 7.3.2 Auto Mask (AMSK)
      3. 7.3.3 PEC
      4. 7.3.4 VDD
      5. 7.3.5 MON
      6. 7.3.6 NIRQ
      7. 7.3.7 NRST
    4. 7.4 Device Functional Modes
      1. 7.4.1 Built-In Self Test and Configuration Load
        1. 7.4.1.1 Notes on BIST Execution
      2. 7.4.2 TPS38800-Q1 Power ON
      3. 7.4.3 General Monitoring
        1. 7.4.3.1 IDLE Monitoring
        2. 7.4.3.2 ACTIVE Monitoring
        3. 7.4.3.3 Sequence Monitoring 1
          1. 7.4.3.3.1 ACT Transitions 0→1
          2. 7.4.3.3.2 SLEEP Transition 1→0
          3. 7.4.3.3.3 SLEEP Transition 0→1
        4. 7.4.3.4 Sequence Monitoring 2
          1. 7.4.3.4.1 ACT Transition 1→0
    5. 7.5 Register Maps
      1. 7.5.1 Registers Overview
        1. 7.5.1.1 BANK0 Registers
        2. 7.5.1.2 BANK1 Registers
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Multichannel Sequencer and Monitor
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Guidelines
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Documentation Support
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

NRST

The NRST pin features a programmable reset delay time that can be adjusted from 0.2ms to 200ms when using I2C RESET time delay register. NRST is an open-drain output, requires an external1kΩ to 100kΩ pullup resistor. When the device is powered up and POR is complete, NRST is asserted low until the BIST is complete. After the BIST, NRST remains high (not asserted) until triggered by a mappable fault condition. An NRST_MISMATCH fault asserts if the NRST pin is pulled to an unexpected state. For example, if the NRST pin is in a high-impedence state (logic high) and is externally pulled low, then an NRST_MISMATCH fault asserts. During an NRST toggle NRST mismatch is active after 2μs, NRST must exceed 0.6*VDD to be considered in a logic high state.

NRST is mappable to the OVHF and UVHF faults using the FC_LF[n] registers. If a monitored voltage falls or rises outside of the programmed OVHF and UVHF thresholds, then NRST is asserted, driving the NRST pin low. When the monitored voltage comes back into the valid window, a reset delay circuit is enabled that holds NRST low for a specified reset delay period (tD).

The tD period is determined by the RST_DLY[2:0] value found in the TI_CONTROL register. When the reset delay has elapsed, the NRST pin goes to a high-impedance state and uses a pullup resistor to hold NRST high. The pullup resistor must be connected to the proper voltage rail to allow other devices to be connected at the correct interface voltage. To maintain proper voltage levels, give consideration when choosing the pullup resistor values. The pullup resistor value is determined by output logic low voltage (VOL), capacitive loading, and leakage current.

TPS38800-Q1 TPS388R0-Q1 NRST  Start Up
                    Behavior Figure 7-9 NRST Start Up Behavior
TPS38800-Q1 TPS388R0-Q1 NRST Timing diagram for voltage faults Figure 7-10 NRST Timing diagram for voltage faults