SNVSCB5B March   2022  – May 2025 TPS388R0-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I2C
      2. 7.3.2 Auto Mask (AMSK)
      3. 7.3.3 PEC
      4. 7.3.4 VDD
      5. 7.3.5 MON
      6. 7.3.6 NIRQ
      7. 7.3.7 NRST
    4. 7.4 Device Functional Modes
      1. 7.4.1 Built-In Self Test and Configuration Load
        1. 7.4.1.1 Notes on BIST Execution
      2. 7.4.2 TPS38800-Q1 Power ON
      3. 7.4.3 General Monitoring
        1. 7.4.3.1 IDLE Monitoring
        2. 7.4.3.2 ACTIVE Monitoring
        3. 7.4.3.3 Sequence Monitoring 1
          1. 7.4.3.3.1 ACT Transitions 0→1
          2. 7.4.3.3.2 SLEEP Transition 1→0
          3. 7.4.3.3.3 SLEEP Transition 0→1
        4. 7.4.3.4 Sequence Monitoring 2
          1. 7.4.3.4.1 ACT Transition 1→0
    5. 7.5 Register Maps
      1. 7.5.1 Registers Overview
        1. 7.5.1.1 BANK0 Registers
        2. 7.5.1.2 BANK1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Multichannel Sequencer and Monitor
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Guidelines
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Documentation Support
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage VDD –0.3 6 V
Voltage NIRQ, NRST –0.3 6 V
Voltage ACT, SLEEP, SCL, SDA –0.3 6 V
Voltage ADDR –0.3 2 V
Voltage MONx –0.3 6 V
Current NIRQ, NRST ±10 mA
Temperature (2) Continuous total power dissipation See the Thermal Information
Operating junction temperature, TJ -40 150 °C
Operating free-air temperature, TA -40 125 °C
Storage temperature, Tstg -65 150 °C
(1) Stresses beyond values listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.
(2) As a result of the low dissipated power in this device,  TJ = TA.