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SN74LV244A

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8-ch, 2-V to 5.5-V buffers with 3-state outputs

Data sheet
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8-ch, 2-V to 5.5-V buffers with 3-state outputs

SN74LV244A

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Product details

Parameters

Technology Family LV-A VCC (Min) (V) 2 VCC (Max) (V) 5.5 Channels (#) 8 IOL (Max) (mA) 16 ICC (Max) (uA) 20 IOH (Max) (mA) -16 Input type Standard CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Data rate (Mbps) 220 Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 TSSOP (PW) 20 42 mm² 6.5 x 6.4 TVSOP (DGV) 20 32 mm² 5 x 6.4 VQFN (RGY) 20 16 mm² 3.5 x 4.5 open-in-new Find other Non-Inverting buffer/driver

Features

  • 2-V to 5.5-V VCC Operation
  • Max tpd of 6.5 ns at 5 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2.3 V at VCC = 3.3 V, TA = 25°C
  • Support Mixed-Mode Voltage Operation on All
    Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 250-mA Per
    JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
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Description

The SN74LV244A octal buffers and line drivers are designed for 2-V to 5.5-V VCC operation.

The SN74LV244A devices are designed specifically to improve both performance and density of the 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. These devices are organized as two 4-bit line drivers with separate output-enable (OE) inputs.

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Technical documentation

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Type Title Date
* Datasheet SN74LV244A Octal Buffers and Drivers With 3-State Outputs datasheet (Rev. N) Oct. 15, 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
View details
EVALUATION BOARD Download
document-generic User guide
20
Description
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic and translation devices with included dual supply support
  • Board has 9 sections that can be broken apart for a smaller form factor
View details

Design tools & simulation

SIMULATION MODEL Download
SCEM137A.ZIP (24 KB) - IBIS Model
SIMULATION MODEL Download
SCEM653.ZIP (7 KB) - PSpice Model

Reference designs

REFERENCE DESIGNS Download
ARM MPU with Integrated BiSS C Master Interface Reference Design
TIDEP0022 — Implementation of BiSS C Master protocol on Industrial Communication Sub-System (PRU-ICSS). The design provides full documentation and source code for Programmable Realtime Unit (PRU).
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REFERENCE DESIGNS Download
ARM MPU with Integrated HIPERFACE DSL Master Interface Reference Design
TIDEP0035 — Implementation of HIPERFACE DSL Master protocol on Industrial Communication Sub-System (PRU-ICSS). The two wire interface allows for integration of position feedback wires into motor cable.  Complete solution consists of AM437x PRU-ICSS firmware and TIDA-00177 transceiver reference design.
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REFERENCE DESIGNS Download
EnDat 2.2 System Reference Design
TIDEP0050 — The TIDEP0050 TI Design implements the EnDat 2.2 Master protocol stack and hardware interface solution based on the HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The design is composed of the EnDat 2.2 Master protocol stack, half-duplex communications using RS485 transceivers and (...)
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REFERENCE DESIGNS Download
Parallel Redundancy Protocol (PRP) Ethernet Reference Design for Substation Automation
TIDEP0054 — This TI Design implements a solution for high-reliability, low-latency network communications for substation automation equipment in Smart Grid transmission and distribution networks. It supports the Parallel Redundancy Protocol (PRP) specification in the IEC 62439 standard using the PRU-ICSS. This (...)
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CAD/CAE symbols

Package Pins Download
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options
TSSOP (PW) 20 View options
TVSOP (DGV) 20 View options
VQFN (RGY) 20 View options

Ordering & quality

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  • Qualification summary
  • Ongoing reliability monitoring

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