44-V, low RON, 1:1 (SPST), four-channel precision multiplexer with 1.8-V logic (logic high)
Product details
Parameters
Package | Pins | Size
Features
- Latch-Up Immune
- Dual Supply Range: ±4.5 V to ±22 V
- Single Supply Range: 4.5 V to 44 V
- Low On-Resistance: 2 Ω
- High current support: 370 mA (max)
- –40°C to +125°C Operating Temperature
- 1.8 V Logic Compatible
- Fail-Safe Logic
- Rail-to-Rail Operation
- Bidirectional Operation
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Description
The TMUX7211, TMUX7212, and TMUX7213 are complementary metal-oxide semiconductor (CMOS) switches with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The devices work with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX721x supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.
The switches of the TMUX721x are controlled with appropriate logic control inputs on the SELx pins. The TMUX721x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.
The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX721x 44-V, Low-RON, 1:1 (SPST), 4-Channel Precision Switches with Latch-Up Immunity and 1.8-V Logic datasheet | Dec. 12, 2020 |
More literature | TMUX7212EVM EU RoHS Declaration of Conformity (DoC) | Jan. 08, 2021 | |
User guide | TMUX721xEVM Evaluation Module | Dec. 15, 2020 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
WQFN (RUM) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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