The TMUX7211, TMUX7212, and TMUX7213 are complementary metal-oxide semiconductor (CMOS) switches with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The devices work with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX721x supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.
The switches of the TMUX721x are controlled with appropriate logic control inputs on the SELx pins. The TMUX721x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.
The TMUX721x family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX721x family of switches and multiplexers to be used in harsh environments.
| Type | Title | Date | |
|---|---|---|---|
| * | Data sheet | TMUX721x 44 V, Low-RON, 1:1 (SPST), 4-Channel Precision Switches with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. C) | 31 Aug 2021 |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 20 Sep 2021 | |
| Application note | Precision Multiplexers Reducing Barriers in an Industrial Environment | 21 May 2021 | |
| Certificate | TMUX7212EVM EU RoHS Declaration of Conformity (DoC) | 08 Jan 2021 | |
| User guide | TMUX721xEVM Evaluation Module | 23 Dec 2020 |
For additional terms or required resources, click any title below to view the detail page where available.
The TMUX721xEVM supports evaluation of the TMUX721x devices in the 16-pin TSSOP (PW) package including TMUX7211PWR, TMUX7212PWR and TMUX7213PWR. This evaluation module can be used for quick prototyping and testing of the TMUX721x devices specifically for DC and timing parameters.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | Download |
|---|---|---|
| TSSOP (PW) | 16 | View options |
| WQFN (RUM) | 16 | View options |
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