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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 2 Ron (Typ) (Ohms) 0.26 ON-state leakage current (Max) (µA) 0.1 Bandwidth (MHz) 23 Operating temperature range (C) -40 to 85 Features Break-before-make, Supports I2C signals, 1.8-V compatible control inputs Input/output continuous current (Max) (mA) 300 Rating Catalog CON (Typ) (pF) 250 Supply current (Typ) (uA) 0.01 open-in-new Find other Analog switches/muxes

Package | Pins | Size

DSBGA (YZP) 10 3 mm² 1.4 x 1.9 VSON (DRC) 10 9 mm² 3.00 x 3.00 VSSOP (DGS) 10 9 mm² 3 x 3 open-in-new Find other Analog switches/muxes

Features

  • Specified break-before-make switching
  • Low ON-state resistance (0.3 Ω max)
  • Low charge injection
  • Excellent ON-state resistance matching
  • Low total harmonic distortion (THD)
  • 1.65-V to 3.6-V Single-supply operation
  • Control inputs are 1.8-V logic compatible
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD Performance tested per JESD 22
    • 2000-V Human-body model
      (A114-B, Class II)
    • 1000-V Charged-device model (C101)

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Description

The TS3A24159 is a 2-channel single-pole double-throw (SPDT) bidirectional analog switch that is designed to operate from 1.65 V to 3.6 V. It offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to another. The device has excellent total harmonic distortion (THD) performance, low ON-state resistence, and consumes very low power. These are some of the features that make this device suitable for a variety of markets and many different applications.

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Technical documentation

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Type Title Date
* Datasheet TS3A24159 0.3-Ω 2-channel SPDT Bidirectional Analog Switch Dual-channel 2:1 Multiplexer and Demultiplexer datasheet (Rev. F) Sep. 23, 2019
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Technical articles Is charge injection causing output voltage errors in your industrial control system? Oct. 18, 2018
Application notes 1.8 V Logic for Muxes and Signal May 16, 2018
Selection guides Analog Switch Guide (Rev. D) Aug. 01, 2012
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCDM118.ZIP (68 KB) - IBIS Model
SIMULATION MODELS Download
SCDM119.ZIP (101 KB) - HSpice Model

Reference designs

REFERENCE DESIGNS Download
Universal data concentrator reference design supporting Ethernet, 6LoWPAN RF mesh and more
TIDA-010032 — IPv6-based grid communications are becoming the standard choice in industrial markets and applications like smart meters and grid automation. The universal data concentrator design provides a complete IPv6-based network solution integrated with Ethernet backbone communication, 6LoWPAN RF mesh (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Wireless IoT, Bluetooth® Low Energy, 4½ Digit, 100kHz True RMS Digital Multimeter
TIDA-01012 — Many products are now becoming connected through the Internet of Things (IoT), including test equipment such as digital multimeters (DMM).  Enabled by Texas Instruments’ SimpleLink™ ultra-low power wireless microcontroller (MCU) platform, the TIDA-01012 reference design demonstrates (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Enhanced Accuracy Battery Fuel Gauge Reference Design for Low Power Industrial IoT Field Metering
TIDA-01014 The Internet of Things (IoT) revolution is efficiently connecting applications and instruments, enabling battery powered, wide scale very low power sensor deployment.  New technologies, such as TI’s advanced sensor and low power connectivity devices, are enabling these instruments to be (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Highly Integrated 4 1/2 Digit Low Power Handheld Digital Multimeter (DMM) Platform Reference Design
TIDA-00879 — The TIDA-00879 TI-Design leverages the features, functions, performance, and state-of-the-art low power and power management capabilities of the MSP430F6736 MCU to demonstrate a highly integrated, low cost, and low power Digital Multimeter platform.  The solution delivers 4.5 digits or 60K (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Voice Band Audio Playback Using a PWM DAC
TIDM-VOICEBANDAUDIO Low cost audio output based upon timer generating PWM & external low-pass filter with amplifier stages for either headphone or speaker. Audio data is stored in an on-board SPI Flash. A PC GUI with launchpad passthrough code is provided to load SPI Flash with audio data.
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 10 View options
VSON (DRC) 10 View options
VSSOP (DGS) 10 View options

Ordering & quality

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