TS5A23157

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5-V, 2:1 (SPDT), 2-channel analog switch

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 10 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 220 Operating temperature range (C) -40 to 125 Features Break-before-make, Supports I2C signals Input/output continuous current (Max) (mA) 50 Rating Catalog CON (Typ) (pF) 17.5 Supply current (Typ) (uA) 1 open-in-new Find other Analog switches & muxes

Package | Pins | Size

UQFN (RSE) 10 3 mm² 2 x 1.5 VSSOP (DGS) 10 9 mm² 3 x 3 open-in-new Find other Analog switches & muxes

Features

  • Low ON-State Resistance (15 Ω at 125℃)
  • 125℃ Operation
  • Control Inputs are 5-V Tolerant
  • Specified Break-Before-Make Switching
  • Low Charge Injection
  • Excellent ON-Resistance Matching
  • Low Total Harmonic Distortion
  • 1.8-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

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open-in-new Find other Analog switches & muxes

Description

The TS5A23157 device is a dual single-pole double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. Signals up to 5.5 V (peak) can be transmitted in either direction.

open-in-new Find other Analog switches & muxes
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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 6
Type Title Date
* Datasheet TS5A23157 Dual 10-Ω SPDT Analog Switch datasheet (Rev. F) Jan. 07, 2019
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
10
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCEM497.ZIP (92 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
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TIDA-00440 This TI design provides a reference solution to measure Insulation Resistance up to 100MΩ. It has an on-board isolated 500Vdc power supply and an isolated signal conditioning circuit to measure the leakage current. This design is useful to find leakage due to insulation breakdown in (...)
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Wireless Subwoofer Amplifier Reference Design
TIDA-00232 This wireless subwoofer amplifier reference design demonstrates the ease of integrating wireless connectivity to a traditional analog input subwoofer design.The wired or wireless mode is controlled by an MSP430. The reference design includes a high performance stereo digital audio amplifier system (...)
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REFERENCE DESIGNS Download
8-ch Isolated High Voltage Analog Input Module with ISOW7841 Reference Design
TIDA-01333 — The TIDA-01333 isolated high voltage analog input module reference design has eight channels supporting both, voltage and current measurement. In addition, 4 channels support common-mode voltages up to ±160V. Isolation of +5V line and the Serial Peripheral Interface  (SPI) communication (...)
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REFERENCE DESIGNS Download
8-ch Isolated High Voltage Analog Input Module Reference Design
TIDA-00764 — The TIDA-00764 reference design is a high voltage analog input module with eight channels. Each channel can be used for both, voltage and current measurement. The TI Design uses the 16-bit analog-to-digital converter (ADC) ADS8681 that can handle input voltage of up to ±12.288V. This make any (...)
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CAD/CAE symbols

Package Pins Download
UQFN (RSE) 10 View options
VSSOP (DGS) 10 View options

Ordering & quality

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