Product details

Processor External MPU Type Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (max) (MBits) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Operating temperature range (°C) -40 to 105 Rating Catalog
Processor External MPU Type Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (max) (MBits) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Operating temperature range (°C) -40 to 105 Rating Catalog
DSBGA (YFV) 130 22.87520000000000493 mm² 4.640000000000001 x 4.93
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

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Technical documentation

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Type Title Date
* Data sheet WL18x1 WiLink™ 8 Single-Band Combo Device Supporting Wi-Fi® , Bluetooth® , and Bluetooth® Low Energy datasheet PDF | HTML 14 May 2021
Cybersecurity advisory Buffer Overflow in WL18xx MCP Driver (Rev. A) PDF | HTML 22 Aug 2023
Cybersecurity advisory WiLink WL18xx PN Reuse Issue PDF | HTML 02 Aug 2023
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 20 Oct 2022
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mar 2022
User guide WiLink8 Getting Started Guide (Rev. B) PDF | HTML 20 Dec 2021
Cybersecurity advisory Bluetooth® Low Energy, Basic/Enhanced Data Rate–PIN-Code Pairing Key Derivation 27 May 2021
Cybersecurity advisory FragAttacks - FRagmentation and AGgregation Attacks (Rev. A) 19 May 2021
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 15 Jan 2021
User guide WiLink8 R8.8 Linux Wi-Fi Driver Release Build User's Guide (Rev. A) PDF | HTML 27 Oct 2020
White paper Charging stations: Toward an EV support infrastructure 09 May 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Software development kit (SDK)

PROCESSOR-SDK-LINUX-AM335X Linux Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Supported products & hardware

Supported products & hardware

Products
Wi-Fi products
WL1807MOD WiLink™ 8 industrial dual band combo, 2x2 MIMO Wi-Fi module WL1831 WiLink™8 single-band industrial Wi-Fi®, Bluetooth® and Bluetooth Low Energy transceiver WL1837MOD WiLink™ 8 industrial dual band, 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module
Arm-based processors
AM3351 Sitara processor: Arm Cortex-A8, 1Gb Ethernet, display AM3352 Sitara processor: Arm Cortex-A8, 1Gb Ethernet, display, CAN AM3354 Sitara processor: Arm Cortex-A8, 3D graphics, CAN AM3356 Sitara processor: Arm Cortex-A8, PRU-ICSS, CAN AM3357 Sitara processor: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN AM3358 Sitara processor: Arm Cortex-A8, 3D graphics, PRU-ICSS, CAN AM3359 Sitara processor: Arm Cortex-A8, EtherCAT, 3D, PRU-ICSS, CAN
Hardware development
TMDSICE3359 AM3359 Industrial Communications Engine TMDSSK3358 AM335x starter kit TMDXEVM3358 AM335x evaluation module
Download options
Software development kit (SDK)

PROCESSOR-SDK-LINUX-RT-AM335X Linux-RT Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Supported products & hardware

Supported products & hardware

Products
Wi-Fi products
WL1807MOD WiLink™ 8 industrial dual band combo, 2x2 MIMO Wi-Fi module WL1831 WiLink™8 single-band industrial Wi-Fi®, Bluetooth® and Bluetooth Low Energy transceiver WL1837MOD WiLink™ 8 industrial dual band, 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module
Arm-based processors
AM3351 Sitara processor: Arm Cortex-A8, 1Gb Ethernet, display AM3352 Sitara processor: Arm Cortex-A8, 1Gb Ethernet, display, CAN AM3354 Sitara processor: Arm Cortex-A8, 3D graphics, CAN AM3356 Sitara processor: Arm Cortex-A8, PRU-ICSS, CAN AM3357 Sitara processor: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN AM3358 Sitara processor: Arm Cortex-A8, 3D graphics, PRU-ICSS, CAN AM3359 Sitara processor: Arm Cortex-A8, EtherCAT, 3D, PRU-ICSS, CAN
Hardware development
TMDSICE3359 AM3359 Industrial Communications Engine TMDXEVM3358 AM335x evaluation module
Download options
Software development kit (SDK)

PROCESSOR-SDK-RTOS-AM335X TI-RTOS Processor SDK for AM335x and AMIC110 devices (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Supported products & hardware

Supported products & hardware

Products
Wi-Fi products
WL1807MOD WiLink™ 8 industrial dual band combo, 2x2 MIMO Wi-Fi module WL1831 WiLink™8 single-band industrial Wi-Fi®, Bluetooth® and Bluetooth Low Energy transceiver WL1837MOD WiLink™ 8 industrial dual band, 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module
Arm-based processors
AM3351 Sitara processor: Arm Cortex-A8, 1Gb Ethernet, display AM3352 Sitara processor: Arm Cortex-A8, 1Gb Ethernet, display, CAN AM3354 Sitara processor: Arm Cortex-A8, 3D graphics, CAN AM3356 Sitara processor: Arm Cortex-A8, PRU-ICSS, CAN AM3357 Sitara processor: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN AM3358 Sitara processor: Arm Cortex-A8, 3D graphics, PRU-ICSS, CAN AM3359 Sitara processor: Arm Cortex-A8, EtherCAT, 3D, PRU-ICSS, CAN AMIC110 Sitara processor: Arm Cortex-A8, 10+ Ethernet protocols
Hardware development
TMDSICE3359 AM3359 Industrial Communications Engine TMDSSK3358 AM335x starter kit TMDXEVM3358 AM335x evaluation module TMDXICE110 AMIC110 Industrial Communications Engine (ICE)
Download options
Application software & framework

WILINK-BT_WIFI-WIRELESS_TOOLS — WiLink™ Wireless Tools for WL18XX modules

This package includes the following applications:
  • WLAN Real-Time Tuning Tool (RTTT)
  • Bluetooth® Logger
  • WLAN gLogger
  • Link Quality Monitor (LQM)
  • HCITester Tool
    • BTSout
    • BTSTransform
    • ScriptPad

The applications provide all of the capabilities required to debug and monitor WiLink™ WLAN/Bluetooth/Bluetooth low (...)

Application software & framework

WILINK-WIFI_MESH_VISUALIZATION_TOOL — WiLink™ Mesh Visualization Tool for WL18XX Modules

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
Driver or library

TI-BT-STACK-LINUX-ADDON — TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone With WL18xx and CC256x

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
Driver or library

WILINK8-WIFI-NLCP WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide

Software block overview:

WL18xx Linux driver uses the open source components along with the interface (...)

Supported products & hardware

Supported products & hardware

Products
Wi-Fi products
WL1801 WiLink™8 single-band industrial Wi-Fi® transceiver WL1801MOD WiLink™ 8 single band Wi-Fi® module WL1805MOD WiLink™ 8 single band, 2x2 MIMO Wi-Fi® module WL1807MOD WiLink™ 8 industrial dual band combo, 2x2 MIMO Wi-Fi module WL1831 WiLink™8 single-band industrial Wi-Fi®, Bluetooth® and Bluetooth Low Energy transceiver WL1831MOD WiLink™ 8 industrial Wi-Fi, Bluetooth & Bluetooth Smart (Low energy) module WL1835MOD WiLink™ 8 single band combo 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module WL1837MOD WiLink™ 8 industrial dual band, 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module
Download options
Driver or library

WL18XX-BT-SP — Bluetooth service pack for WL18xx

The Bluetooth Service Pack is composed of the following four files:

  • BTS file (TIInit_11.8.32.bts)
  • ILI file (TIInit_11.8.32.ili)
  • XML (TIInit_11.8.32.xml)
  • Release Notes Document
  • License Agreement

Note the version in the file name is unique for combination of hardware and firmware, but is not (...)

Design tool

3P-WIRELESS-MODULES — Third party wireless module search tool

The third party wireless module search tool helps developers to identify products that meet their end equipment specifications and procure production ready wireless modules. The third party module vendors included in the search tool are independent third party companies with expertise in designing (...)
Package Pins Download
DSBGA (YFV) 130 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

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