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CC2755P20

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2,4-GHz-Multiprotokoll-MCU mit On-Chip-HSM, Edge-KI, 2 MB Flash, +20 dBm, <1 µA Standby

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CC2755P20

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Produktdetails

CPU Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 2048 RAM (kByte) 288 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23, 32, 40 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Cryptographic accelerators AES, TRNG Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125
CPU Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 2048 RAM (kByte) 288 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23, 32, 40 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Cryptographic accelerators AES, TRNG Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • 2MB of in-system programmable flash
  • 288KB of SRAM
  • 36KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs have wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.2mA
  • TX current at 0dBm: 7.7mA
  • TX current at +5dBm: 10.6mA
  • TX current at +20dBm: 132mA
  • Active mode MCU 96MHz (CoreMark): 6.7mA
  • Standby: 1.1µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160.8nA
  • Matter
  • Thread
  • Zigbee®
  • Bluetooth Low Energy Core 6.0 Qualified with support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Proprietary 2.4GHz systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R version)
  • Output power up to +20dBm (P version)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • IEEE 802.15.4 (2.4GHz): –103dBm
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • 2MB of in-system programmable flash
  • 288KB of SRAM
  • 36KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs have wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.2mA
  • TX current at 0dBm: 7.7mA
  • TX current at +5dBm: 10.6mA
  • TX current at +20dBm: 132mA
  • Active mode MCU 96MHz (CoreMark): 6.7mA
  • Standby: 1.1µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160.8nA
  • Matter
  • Thread
  • Zigbee®
  • Bluetooth Low Energy Core 6.0 Qualified with support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Proprietary 2.4GHz systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R version)
  • Output power up to +20dBm (P version)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • IEEE 802.15.4 (2.4GHz): –103dBm
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks

The SimpleLink™ CC2755x20 family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.0 and the upcoming versions), Zigbee (4.0 and the upcoming versions), Matter (1.5 and the upcoming versions), Thread (1.4 and the upcoming versions), and other 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.x and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Supports an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and secure phase-based ranging mechanism for distance estimation
    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT and super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC)
  • Arm Custom Datapath Extension (CDE) instruction support for machine learning acceleration
  • Matter stack available on https://github.com/TexasInstruments/matter
  • Thread protocol stack available on https://github.com/TexasInstruments/ot-ti
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 288KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with very low standby current
  • Integrated balun and integrated RF switch to support both transmit and receive operations on the same RF pin, even at +20dBm transmit power; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy and IEEE 802.15.4

The CC2755x20 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2755x20 family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.0 and the upcoming versions), Zigbee (4.0 and the upcoming versions), Matter (1.5 and the upcoming versions), Thread (1.4 and the upcoming versions), and other 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.x and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Supports an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and secure phase-based ranging mechanism for distance estimation
    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT and super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC)
  • Arm Custom Datapath Extension (CDE) instruction support for machine learning acceleration
  • Matter stack available on https://github.com/TexasInstruments/matter
  • Thread protocol stack available on https://github.com/TexasInstruments/ot-ti
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 288KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with very low standby current
  • Integrated balun and integrated RF switch to support both transmit and receive operations on the same RF pin, even at +20dBm transmit power; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy and IEEE 802.15.4

The CC2755x20 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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Technische Dokumentation

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* Errata CC2755P20 SimpleLink Wireless MCU Errata PDF | HTML 18 Jun 2026
User guide CC2755P20 SimpleLink Wireless MCU Technical Reference Manual PDF | HTML 18 Jun 2026

Design und Entwicklung

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SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx, CC26xx and CC27xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, (...)

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SIMPLELINK-LOWPOWER-ZEPHYR-SDK — Zephyr® Platform support for the SimpleLink™ Low Power family of devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx, CC26xx and CC27xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, (...)

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Software-Entwicklungskit (SDK)

SIMPLELINK-MATTER — SimpleLink™ family of devices Matter software

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx, CC26xx and CC27xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, (...)

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Software-Entwicklungskit (SDK)

SIMPLELINK-TI-OPENTHREAD-SDK — SimpleLink™ family of devices OpenThread software

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx, CC26xx and CC27xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, (...)

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IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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EDGE-AI-STUDIO-MCU — Edge AI Studio for Microcontrollers

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SYSCONFIG — Standalone desktop version of SysConfig

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SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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Zertifizierung

CC27XX-REPORTS — LP-EM-CC27XX CE & FCC Certification Reports & DOC for Reference-only

This page provides access to the CC27XX certification reports for the CC27XX EVMs. EVM certification reports are provided for reference only. When using a chip down design, the customer is responsible for their own certification.
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SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

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