DM3730

AKTIV

Digital-Media-Prozessor

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Datenblatt

document-pdfAcrobat DM3730, DM3725 Digital Media Processors datasheet (Rev. D) (Englisch)

DM3730

AKTIV

Datenblatt

Jetzt bestellen

Produktdetails

CPU

1 Arm Cortex-A8

Frequency (MHz)

800, 1000

Graphics acceleration

1 3D

Display type

2 LCD

Protocols

Ethernet

Hardware accelerators

Image video accelerator

Operating system

Linux, RTOS

Rating

Catalog

Operating temperature range (°C)

-40 to 105

CPU

1 Arm Cortex-A8

Frequency (MHz)

800, 1000

Graphics acceleration

1 3D

Display type

2 LCD

Protocols

Ethernet

Hardware accelerators

Image video accelerator

Operating system

Linux, RTOS

Rating

Catalog

Operating temperature range (°C)

-40 to 105

FCCSP (CBP)

515

144 mm² (12 mm × 12 mm)

FCCSP (CUS)

423

256 mm² (16 mm × 16 mm)

FCCSP (CBC)

515

196 mm² (14 mm × 14 mm)

DM3730, DM3725 Digital Media Processors:
- Compatible with OMAP™ 3 Architecture
- ARM® microprocessor (MPU) Subsystem
  - Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
  - NEON SIMD Coprocessor
- High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
  - Up to 800-MHz TMS320C64x+™ DSP Core
  - Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
  - Video Hardware Accelerators
- POWER SGX™ Graphics Accelerator (DM3730 only)
  - Tile Based Acrchitecture Delivering up to 20 MPoly/sec
  - Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
  - Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
  - Fine Grained Task Switching, Load Balancing, and Power Management
  - Programmable High Quality Image Anti-Aliasing
- Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
  - Eight Highly Independent Functional Units
  - Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
  - Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
  - Load-Store Architecture With Non-Aligned Support
  - 64 32-Bit General-Purpose Registers
  - Instruction Packing Reduces Code Size
  - All Instructions Conditional
  - Additional C64x+™ Enhancements
    - Protected Mode Operation
    - Expectations Support for Error Detection and Program Redirection
    - Hardware Support for Modulo Loop Operation
- C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

DM3730, DM3725 Digital Media Processors:
- Compatible with OMAP™ 3 Architecture
- ARM® microprocessor (MPU) Subsystem
  - Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
  - NEON SIMD Coprocessor
- High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
  - Up to 800-MHz TMS320C64x+™ DSP Core
  - Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
  - Video Hardware Accelerators
- POWER SGX™ Graphics Accelerator (DM3730 only)
  - Tile Based Acrchitecture Delivering up to 20 MPoly/sec
  - Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
  - Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
  - Fine Grained Task Switching, Load Balancing, and Power Management
  - Programmable High Quality Image Anti-Aliasing
- Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
  - Eight Highly Independent Functional Units
  - Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
  - Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
  - Load-Store Architecture With Non-Aligned Support
  - 64 32-Bit General-Purpose Registers
  - Instruction Packing Reduces Code Size
  - All Instructions Conditional
  - Additional C64x+™ Enhancements
    - Protected Mode Operation
    - Expectations Support for Error Detection and Program Redirection
    - Hardware Support for Modulo Loop Operation
- C64x+TM L1/L2 Memory Architecture

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

Portable Data Terminals
Navigation
Auto Infotainment
Gaming
Medical Imaging
Home Automation
Human Interface
Industrial Control
Test and Measurement
Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
The clock specifications: input and output clocks, DPLL and DLL
A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

Portable Data Terminals
Navigation
Auto Infotainment
Gaming
Medical Imaging
Home Automation
Human Interface
Industrial Control
Test and Measurement
Single board Computers

A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
The clock specifications: input and output clocks, DPLL and DLL
A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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Top-Dokumentation	Typ	Titel	Format-Optionen	Datum
*	Datenblatt	DM3730, DM3725 Digital Media Processors datasheet (Rev. D)		11.04.2011
*	Errata	DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F)		13.02.2014
	Anwendungshinweis	OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles	PDF \| HTML	20.03.2019
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	Anwendungshinweis	PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)		01.11.2013
	Benutzerhandbuch	AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R)		10.09.2012
	Benutzerhandbuch	Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q)		10.09.2012
	Weitere Dokumente	DM37x Design Network Partners		05.06.2012
	Anwendungshinweis	TI OMAP4430 POP SMT Design Guideline (Rev. C)		03.11.2011
	Anwendungshinweis	Introduction to TMS320C6000 DSP Optimization		06.10.2011
	Anwendungshinweis	PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs		15.06.2011
	Product overview	DM3730 Product Bulletin		07.09.2010
	Anwendungshinweis	PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II		23.06.2010
	Anwendungshinweis	PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I		23.06.2010
	Anwendungshinweis	AM/DM37x Power Estimation Spreadsheet		07.06.2010
	Anwendungshinweis	AM/DM37x Overview		03.06.2010
	Anwendungshinweis	Setting up AM37x SDRC Registers		03.06.2010
	Anwendungshinweis	AM37x CUS Routing Guidelines		03.06.2010
	Anwendungshinweis	AM3715/03 Memory Subsystem		03.06.2010
	Benutzerhandbuch	Flip Chip Ball Grid Array Package Reference Guide (Rev. A)		23.05.2005
	Anwendungshinweis	AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)		01.05.2004

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