SN74AVC2T245

ACTIVO

Transceptor de bus de alimentación doble de 2 bits y 2 pines DIR con traducción de tensión configura

Se encuentra disponible una versión más nueva de este producto

open-in-new Comparar alternativas
Reemplazo con funcionalidad mejorada del dispositivo comparado
SN74AXC2T245 ACTIVO Transceptor de bus de alimentación doble de 2 bits y 2 pines DIR con traducción de tensión configura Pin-to-pin upgrade with a wider voltage range and improved performance

Detalles del producto

Technology family AVC Applications JTAG Bits (#) 2 High input voltage (min) (V) 0.78 High input voltage (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 3.6 Data rate (max) (Mbps) 500 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 16 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type 3-State, Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AVC Applications JTAG Bits (#) 2 High input voltage (min) (V) 0.78 High input voltage (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 3.6 Data rate (max) (Mbps) 500 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 16 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type 3-State, Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
UQFN (RSW) 10 2.52 mm² 1.8 x 1.4
  • Each Channel Has Independent Direction Control
  • Control Inputs VIH/VIL Levels Are Referenced to
    VCCA Voltage
  • Fully Configurable Dual-Rail Design Allows Each
    Port to Operate Over the Full 1.2 V to
    3.6 V Power-Supply Range
  • I/Os Are 4.6 V Tolerant
  • Ioff Supports Partial-Power-Down Mode Operation
  • VCC Isolation Feature - If Either VCC Input is at
    GND, Both Ports are in High-Impedance State
  • Typical Data Rates
    • 500 Mbps (1.8 V to 3.3 V Level-Shifting)
    • 320 Mbps (<1.8 V to 3.3 V Level-Shifting)
    • 320 Mbps (Translate to 2.5 V or 1.8 V)
    • 280 Mbps (Translate to 1.5 V)
    • 240 Mbps (Translate to 1.2 V)
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 5000 V Human-Body Model (A114-A)
    • 200 V Machine Model (A115-A)
    • 1500 V Charged-Device Model (C101)
  • Each Channel Has Independent Direction Control
  • Control Inputs VIH/VIL Levels Are Referenced to
    VCCA Voltage
  • Fully Configurable Dual-Rail Design Allows Each
    Port to Operate Over the Full 1.2 V to
    3.6 V Power-Supply Range
  • I/Os Are 4.6 V Tolerant
  • Ioff Supports Partial-Power-Down Mode Operation
  • VCC Isolation Feature - If Either VCC Input is at
    GND, Both Ports are in High-Impedance State
  • Typical Data Rates
    • 500 Mbps (1.8 V to 3.3 V Level-Shifting)
    • 320 Mbps (<1.8 V to 3.3 V Level-Shifting)
    • 320 Mbps (Translate to 2.5 V or 1.8 V)
    • 280 Mbps (Translate to 1.5 V)
    • 240 Mbps (Translate to 1.2 V)
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 5000 V Human-Body Model (A114-A)
    • 200 V Machine Model (A115-A)
    • 1500 V Charged-Device Model (C101)

This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation between any of the 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V voltage nodes.

The SN74AVC2T245 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input and the output-enable (OE) activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode . The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ.

The SN74AVC2T245 control pins (DIR1, DIR2, and OE) are supplied by VCCA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature ensures that if either VCC input is at GND, both ports are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE must be connected to VCC through a pull-up resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation between any of the 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V voltage nodes.

The SN74AVC2T245 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input and the output-enable (OE) activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode . The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ.

The SN74AVC2T245 control pins (DIR1, DIR2, and OE) are supplied by VCCA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature ensures that if either VCC input is at GND, both ports are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE must be connected to VCC through a pull-up resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Descargar Ver vídeo con transcripción Video

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 15
Tipo Título Fecha
* Data sheet SN74AVC2T245 Dual-Bit Dual-Supply Bus Transceiver with Configurable Level-Shifting / Voltage Translation and Tri-State Outputs datasheet (Rev. D) PDF | HTML 22 feb 2016
Selection guide Voltage Translation Buying Guide (Rev. A) 15 abr 2021
EVM User's guide SN74AXC2T-SMALLPKGEVM Evaluation module user's guide 04 jun 2019
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
Application note Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B) 30 abr 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
More literature LCD Module Interface Application Clip 09 may 2003
User guide AVC Advanced Very-Low-Voltage CMOS Logic Data Book, March 2000 (Rev. C) 20 ago 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B) 07 jul 1999
Application note AVC Logic Family Technology and Applications (Rev. A) 26 ago 1998

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

AXC2T-SMALLPKGEVM — Módulo de evaluación de paquete pequeño AXC2T para dispositivos de paquete DTM y RSW

This EVM is designed to support DTM and RSW packages for the AXC and LVC family of DIR controlled bidirectional devices. The AXC and AVC devices belong to the low voltage direction controlled translation family with operating voltage from 0.65V to 3.6V (AXC) and 1.2 to 3.6 (AVC) with 12mA of drive (...)
Guía del usuario: PDF
Kit de desarrollo

EVMK2GX — Módulo de evaluación 66AK2Gx de 1 GHz

The EVMK2GX (also known as "K2G") 1GHz evaluation module (EVM) enables developers to immediately start evaluating the 66AK2Gx processor family, and to accelerate the development of audio, industrial motor control, smart grid protection and other high reliability, real-time compute intensive (...)

Guía del usuario: PDF
Modelo de simulación

HSPICE Model for SN74AVC2T245

SCEM533.ZIP (102 KB) - HSpice Model
Modelo de simulación

SN74AVC2T245 IBIS Model

SCEM532.ZIP (64 KB) - IBIS Model
Diseños de referencia

TIDEP0050 — Diseño de referencia de sistema EnDat 2.2

This reference design implements EnDat 2.2 Master protocol stack and hardware interface based on HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The design is composed of EnDat 2.2 Master protocol stack, half-duplex communications using RS-485 transceivers and the line termination (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-00403 — Diseño de referencia de la medición de distancia ultrasónica mediante el uso del CÓDEC miniDSP TLV32

The TIDA-00403 reference design uses off-the-shelf EVMs for ultrasonic distance measurement solutions using algorithms within the TLV320AIC3268 miniDSP. In conjunction with TI’s PurePath Studio design suite, a robust and user configurable ultrasonic distance measurement system can be designed (...)
Design guide: PDF
Esquema: PDF
Paquete Pasadores Descargar
UQFN (RSW) 10 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos