The TLV2231 is a single low-voltage
operational amplifier available in the SOT-23 package. The TLV2231 offers 2MHz of
bandwidth and 1.6V/µs of slew rate for applications requiring good ac performance.
The device exhibits rail-to-rail output performance for increased dynamic range in
single- or split-supply applications. The TLV2231 is fully characterized at 3V and
5V and is optimized for low-voltage applications.
The TLV2231, with a high input
impedance and low noise, is excellent for small-signal conditioning of
high-impedance sources, such as piezoelectric transducers. As a result of the
micropower dissipation levels combined with 3V operation, these devices work well in
hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail
output feature with single- or split-supplies makes this family a great choice when
interfacing with analog-to-digital converters (ADCs). The device also drives 600Ω
loads for telecom applications.
With a total area of
5.6mm2, the SOT-23 package only requires one-third the board space of the
standard 8-pin SOIC package. This ultra-small package allows designers to place
single amplifiers very close to the signal source, and minimizes noise pick-up from
long printed circuit board (PCB) traces. TI also takes special care to provide a
pinout that is optimized for board layout (see the following figure). Both inputs
are separated by ground to prevent coupling or leakage paths. The OUT and IN– pins
are on the same end of the board to provide negative feedback. Finally, gain setting
resistors and the decoupling capacitor are easily placed around the package.
The TLV2231 is a single low-voltage
operational amplifier available in the SOT-23 package. The TLV2231 offers 2MHz of
bandwidth and 1.6V/µs of slew rate for applications requiring good ac performance.
The device exhibits rail-to-rail output performance for increased dynamic range in
single- or split-supply applications. The TLV2231 is fully characterized at 3V and
5V and is optimized for low-voltage applications.
The TLV2231, with a high input
impedance and low noise, is excellent for small-signal conditioning of
high-impedance sources, such as piezoelectric transducers. As a result of the
micropower dissipation levels combined with 3V operation, these devices work well in
hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail
output feature with single- or split-supplies makes this family a great choice when
interfacing with analog-to-digital converters (ADCs). The device also drives 600Ω
loads for telecom applications.
With a total area of
5.6mm2, the SOT-23 package only requires one-third the board space of the
standard 8-pin SOIC package. This ultra-small package allows designers to place
single amplifiers very close to the signal source, and minimizes noise pick-up from
long printed circuit board (PCB) traces. TI also takes special care to provide a
pinout that is optimized for board layout (see the following figure). Both inputs
are separated by ground to prevent coupling or leakage paths. The OUT and IN– pins
are on the same end of the board to provide negative feedback. Finally, gain setting
resistors and the decoupling capacitor are easily placed around the package.