TMP461-SP

ACTIVO

Sensor de temperatura local y remoto de alta precisión con dureza garantizada por radiación (RHA)

Detalles del producto

Local sensor accuracy (max) 2 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 3.6 Features ALERT Supply current (max) (µA) 2 Temp resolution (max) (Bits) 12 Remote channels (#) 1 Addresses 9 Rating Space
Local sensor accuracy (max) 2 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 3.6 Features ALERT Supply current (max) (µA) 2 Temp resolution (max) (Bits) 12 Remote channels (#) 1 Addresses 9 Rating Space
CFP (HKU) 10 45.4896 mm² 7.02 x 6.48
  • QMLV Qualified: 5962R-1721801VXC
    • Thermally Enhanced HKU Package
    • Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
    • Single Event Latchup (SEL) Immune to 76 MeV·cm2/mg at 125°C
    • 10-Lead HKU Ceramic Package
  • Remote Diode Temperature Sensor Accuracy: ±1.5°C (Across Extended Temperature Range of [–55°C to 125°C])
  • Local Temperature Sensor Accuracy: ±2°C (Across Extended Temperature Range of [–55°C to 125°C])
  • Enables Measurement Of Remote Diode Temperatures in the Range of –64°C to 191°C
  • Resolution for Local and Remote Channels: 0.0625°C
  • Supply and Logic Voltage Range: 1.7 V to 3.6 V
  • 35-µA Operating Current (1 SPS),
    3-µA Shutdown Current
  • Series Resistance Cancellation
  • η-Factor and Offset Correction
  • Programmable Digital Filter
  • Diode Fault Detection
  • Two-Wire and SMBus™ Serial Interface Compatible with Pin-Programmable Address
  • QMLV Qualified: 5962R-1721801VXC
    • Thermally Enhanced HKU Package
    • Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
    • Single Event Latchup (SEL) Immune to 76 MeV·cm2/mg at 125°C
    • 10-Lead HKU Ceramic Package
  • Remote Diode Temperature Sensor Accuracy: ±1.5°C (Across Extended Temperature Range of [–55°C to 125°C])
  • Local Temperature Sensor Accuracy: ±2°C (Across Extended Temperature Range of [–55°C to 125°C])
  • Enables Measurement Of Remote Diode Temperatures in the Range of –64°C to 191°C
  • Resolution for Local and Remote Channels: 0.0625°C
  • Supply and Logic Voltage Range: 1.7 V to 3.6 V
  • 35-µA Operating Current (1 SPS),
    3-µA Shutdown Current
  • Series Resistance Cancellation
  • η-Factor and Offset Correction
  • Programmable Digital Filter
  • Diode Fault Detection
  • Two-Wire and SMBus™ Serial Interface Compatible with Pin-Programmable Address

The TMP461-SP device is a radiation-hardened, high-accuracy, low-power remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensors are typically low-cost discrete NPN or PNP transistors, or substrate thermal transistors or diodes that are integral parts of microprocessors, analog-to-digital converters (ADC), digital-to-analog converters (DAC), microcontrollers, or field-programmable gate arrays (FPGA). Temperature is represented as a 12-bit digital code for both local and remote sensors, giving a resolution of 0.0625°C. The two-wire serial interface accepts the SMBus communication protocol with up to nine different pin-programmable addresses.

Advanced features such as series resistance cancellation, programmable nonideality factor (η-factor), programmable offset, programmable temperature limits, and a programmable digital filter, are combined to provide a robust thermal monitoring solution with improved accuracy and noise immunity.

The TMP461-SP is ideal for multi-location, high-accuracy temperature measurements in a variety of distributed telemetry applications. The integrated local and remote temperature sensors simplify spacecraft housekeeping activities by providing an easy way of measuring temperature gradients. The device is specified for operation over a supply voltage range of 1.7 V to 3.6 V, and a temperature range of –55°C to 125°C.

The TMP461-SP device is a radiation-hardened, high-accuracy, low-power remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensors are typically low-cost discrete NPN or PNP transistors, or substrate thermal transistors or diodes that are integral parts of microprocessors, analog-to-digital converters (ADC), digital-to-analog converters (DAC), microcontrollers, or field-programmable gate arrays (FPGA). Temperature is represented as a 12-bit digital code for both local and remote sensors, giving a resolution of 0.0625°C. The two-wire serial interface accepts the SMBus communication protocol with up to nine different pin-programmable addresses.

Advanced features such as series resistance cancellation, programmable nonideality factor (η-factor), programmable offset, programmable temperature limits, and a programmable digital filter, are combined to provide a robust thermal monitoring solution with improved accuracy and noise immunity.

The TMP461-SP is ideal for multi-location, high-accuracy temperature measurements in a variety of distributed telemetry applications. The integrated local and remote temperature sensors simplify spacecraft housekeeping activities by providing an easy way of measuring temperature gradients. The device is specified for operation over a supply voltage range of 1.7 V to 3.6 V, and a temperature range of –55°C to 125°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TMP461-SP Radiation-Hardness-Assured (RHA), High-Accuracy Remote and Local Temperature Sensor datasheet (Rev. B) PDF | HTML 19 feb 2018
* Radiation & reliability report TMP461-SP Single-Event Effects (SEE) Radiation Test Report (Rev. D) PDF | HTML 27 nov 2023
* Radiation & reliability report TMP461-SP Total Ionizing Dose (TID) Report (Rev. C) 04 ene 2021
* Radiation & reliability report TMP461-SP (5962R1721701VXC) Neutron Displacement Damage Characterization 10 sep 2018
* SMD TMP461-SP SMD 5962-17218 22 mar 2018
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 31 ago 2023
White paper Space Power Supply for the STAR-Tiger SpaceFibre Routing Switch PDF | HTML 27 jul 2023
Selection guide TI Space Products (Rev. I) 03 mar 2022
Application note Remote Temperature Transistor Sensor Selection Guide PDF | HTML 24 mar 2021
Technical article Satellite state of health: how space-grade ICs are improving telemetry circuit des PDF | HTML 26 ene 2021
E-book Radiation Handbook for Electronics (Rev. A) 21 may 2019
User guide TSW12D1620EVM-CVAL User's Guide (Rev. A) 29 ene 2019
Application note Measuring Die Temperature with Remote Diode Sensing in Space 10 dic 2018

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TMP461EVM-CVAL — Módulo de evaluación de sensor de temperatura local y remoto de alta precisión con dureza garantizad

The TMP461-SP device is a high-accuracy, low-power remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensors are typically low-cost discrete NPN or PNP transistors, or substrate thermal transistors or diodes that are integral parts of (...)

Guía del usuario: PDF
Placa de evaluación

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The TSW12D1620EVM-CVAL is a 1.5-GHz wideband receiver evaluation module (EVM) that includes ceramic engineering models of the amplifier, analog-to-digital converter (ADC), clocking, temperature sensor, microcontroller, and power solution. The board is best suited for (...)

Guía del usuario: PDF
Kit de desarrollo

ALPHA-XILINX-KU060-SPACE — Placa Alpha Data® para Xilinx® Kintex® UltraScale™ XQRKU060 FPGA con potencia TI

This is a development kit for the Xilinx® XQRKU060 FPGA with industrial -1 speed grade. ADA-SDEV-KIT2 has a modular board design with a XRTC-compatible configuration module, two FMC connectors, DDR3 DRAM, system monitoring, and space-grade TI power management and temperature-sensing solutions.
Firmware

SBAC235 MSP430FR5969 Firmware

lock = Requiere aprobación de exportación (1 minuto)
Productos y hardware compatibles

Productos y hardware compatibles

Productos
Sensores de temperatura digitales
TMP461-SP Sensor de temperatura local y remoto de alta precisión con dureza garantizada por radiación (RHA)
Microcontroladores MSP430
MSP430FR5969 MCU de 16 MHz con 64 KB FRAM, 2 KB SRAM, AES, 12 bit ADC, comparador, DMA, UART/SPI/I2C, temporizado MSP430FR5969-SP Microcontrolador de señal mixta reforzado contra la radiación
ADC de alta velocidad (≥ 10 MSPS)
ADC12D1620QML-SP Protección contra la radiación garantizada (RHA), QMLV, 300 krad, 12 bits, ADC 1.6 GSPS doble o ADC
Desarrollo de hardware
Placa de evaluación
TSW12D1620EVM-CVAL Módulo de evaluación de receptor de banda ancha de calidad espacial ADC12D1620QML-SP
Modelo de simulación

TMP461 and TMP461-SP IBIS MODEL

SLAM269.ZIP (53 KB) - IBIS Model
Diseños de referencia

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Design guide: PDF
Diseños de referencia

TIDA-010197 — Diseño versátil de referencia de plataforma de control y monitoreo del estado de los satélites con <

Este diseño de referencia presenta un diseño altamente modular para sistemas de telemetría por satélite resistentes a la radiación que utiliza la versatilidad del LMP7704-SP para monitorizar con precisión la temperatura, la tensión y la corriente para proporcionar información a la placa host. (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-070004 — Diseño de referencia de grado espacial con sensor integrado de temperatura de salida digital

This reference design illustrates the fact that several spacecraft projects provide a system health status telemetry that ground personnel monitor in real time. This reference design shows an example using a digital output temperature sensor to acquire temperature data on a sub-system using a (...)
Design guide: PDF
Esquema: PDF
Paquete Pasadores Descargar
CFP (HKU) 10 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

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