제품 상세 정보

CPU 2 Arm Cortex-A15 Frequency (MHz) 1250, 1400 Protocols Ethernet PCIe 4 PCIe Gen 2 Hardware accelerators Packet Accelerator, Security Accelerator Features Networking Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 100
CPU 2 Arm Cortex-A15 Frequency (MHz) 1250, 1400 Protocols Ethernet PCIe 4 PCIe Gen 2 Hardware accelerators Packet Accelerator, Security Accelerator Features Networking Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 100
  • ARM® Cortex®-A15 MPCore™ CorePac
    • Up to Four ARM Cortex-A15 Processor Cores at
      up to 1.4-GHz
    • 4MB L2 Cache Memory Shared by all Cortex-
      A15 Processor Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC (Multicore
      Shared Memory Controller) for Low Latency
      Access to SRAM and DDR3
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory for ARM CorePac
    • Memory Protection Unit for Both SRAM and
      DDR3_EMIF
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • One Packet-Based DMA Engine for Zero-
      Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP,
        PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP and WiMAX Air
        Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM,
        HMAC, CMAC, GMAC, AES, DES, 3DES,
        Kasumi, SNOW 3G, SHA-1, SHA-2 (256-bit
        Hash), MD5
      • Up to 6.4 Gbps IPSec and 3 Gbps Air
        Ciphering
    • Ethernet Subsystem
      • Eight SGMII Ports with Wire Rate Switching
      • IEEE1588 v2 (with Annex D/E/F) Support
      • 8 Gbps Total Ingress/Egress Ethernet BW
        from Core
      • Audio/Video Bridging (802.1Qav/D6.0)
      • QOS Capability
      • DSCP Priority Mapping
  • Peripherals
    • Two PCIe Gen2 Controllers with Support for
      • Two Lanes per Controller
      • Supports Up to 5 GBaud
    • One HyperLink
      • Supports Connections to Other KeyStone Architecture
        Devices Providing Resource
        Scalability
      • Supports Up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem
      • Two SGMII/XFI Ports with Wire Rate
        Switching and MACSEC Support
      • IEEE1588 v2 (with Annex D/E/F) Support
    • One 72-Bit DDR3/DDR3L Interface with Speeds Up
      to 1600 MTPS in DDR3 Mode
    • EMIF16 Interface
    • Two USB 2.0/3.0 Controllers
    • USIM Interface
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • One TSIP
      • Support 1024 DS0s
      • Support 2 Lanes at 32.768/16.3848.192
        Mbps Per Lane
  • System Resources
    • Three On-Chip PLLs
    • SmartReflex Automatic Voltage Scaling
    • Semaphore Module
    • Twelve 64-Bit Timers
    • Five Enhanced Direct Memory Access (EDMA)
      Modules
  • Commercial Case Temperature:
    • 0°C to 85°C
  • Extended Case Temperature:
    • –40°C to 100°C
  • ARM® Cortex®-A15 MPCore™ CorePac
    • Up to Four ARM Cortex-A15 Processor Cores at
      up to 1.4-GHz
    • 4MB L2 Cache Memory Shared by all Cortex-
      A15 Processor Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC (Multicore
      Shared Memory Controller) for Low Latency
      Access to SRAM and DDR3
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory for ARM CorePac
    • Memory Protection Unit for Both SRAM and
      DDR3_EMIF
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • One Packet-Based DMA Engine for Zero-
      Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP,
        PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP and WiMAX Air
        Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM,
        HMAC, CMAC, GMAC, AES, DES, 3DES,
        Kasumi, SNOW 3G, SHA-1, SHA-2 (256-bit
        Hash), MD5
      • Up to 6.4 Gbps IPSec and 3 Gbps Air
        Ciphering
    • Ethernet Subsystem
      • Eight SGMII Ports with Wire Rate Switching
      • IEEE1588 v2 (with Annex D/E/F) Support
      • 8 Gbps Total Ingress/Egress Ethernet BW
        from Core
      • Audio/Video Bridging (802.1Qav/D6.0)
      • QOS Capability
      • DSCP Priority Mapping
  • Peripherals
    • Two PCIe Gen2 Controllers with Support for
      • Two Lanes per Controller
      • Supports Up to 5 GBaud
    • One HyperLink
      • Supports Connections to Other KeyStone Architecture
        Devices Providing Resource
        Scalability
      • Supports Up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem
      • Two SGMII/XFI Ports with Wire Rate
        Switching and MACSEC Support
      • IEEE1588 v2 (with Annex D/E/F) Support
    • One 72-Bit DDR3/DDR3L Interface with Speeds Up
      to 1600 MTPS in DDR3 Mode
    • EMIF16 Interface
    • Two USB 2.0/3.0 Controllers
    • USIM Interface
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • One TSIP
      • Support 1024 DS0s
      • Support 2 Lanes at 32.768/16.3848.192
        Mbps Per Lane
  • System Resources
    • Three On-Chip PLLs
    • SmartReflex Automatic Voltage Scaling
    • Semaphore Module
    • Twelve 64-Bit Timers
    • Five Enhanced Direct Memory Access (EDMA)
      Modules
  • Commercial Case Temperature:
    • 0°C to 85°C
  • Extended Case Temperature:
    • –40°C to 100°C

The AM5K2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor dual-core or quad-core CorePac that can run at a core speed of up to 1.4 GHz. TI’s AM5K2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

The AM5K2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.

The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.

The AM5K2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor dual-core or quad-core CorePac that can run at a core speed of up to 1.4 GHz. TI’s AM5K2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

The AM5K2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.

The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.

이 제품에 사용할 수 있는 세부 정보가 없습니다.
다운로드 스크립트와 함께 비디오 보기 비디오

기술 자료

검색된 결과가 없습니다. 검색어를 지우고 다시 시도하세요.
52개 모두 보기
상위 문서 유형 직함 형식 옵션 최신 영어 버전 다운로드 날짜
* 데이터 시트 AM5K2E04/02 Multicore ARM KeyStone II System-on-Chip (SoC) datasheet (Rev. D) 2015. 3. 11
* 정오표 AM5K2E04/02 KeyStone SoC Silicon Errata (Silicon Rev 1.0) (Rev. B) 2015. 8. 20
애플리케이션 노트 DDR3 Design Requirements for KeyStone Devices (Rev. D) PDF | HTML 2022. 7. 7
애플리케이션 노트 Using Arm ROM Bootloader on Keystone II Devices PDF | HTML 2019. 6. 4
애플리케이션 노트 Keystone Multicore Device Family Schematic Checklist PDF | HTML 2019. 5. 17
애플리케이션 노트 KeyStone II DDR3 interface bring-up PDF | HTML 2019. 3. 7
사용 설명서 How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS 2018. 9. 24
사용 설명서 KeyStone II Architecture Universal Serial Bus 3.0 (USB 3.0) (Rev. A) 2017. 8. 21
애플리케이션 노트 Thermal Design Guide for DSP and Arm Application Processors (Rev. B) 2017. 8. 14
사용 설명서 Phase-Locked Loop (PLL) for KeyStone Devices User's Guide (Rev. I) 2017. 7. 26
애플리케이션 노트 Power Consumption Summary for K2E System-on-Chip (SoC) Device Family 2017. 6. 14
애플리케이션 노트 Clocking Spreadsheet for K2E Device Family 2017. 1. 26
사용 설명서 Serializer/Deserializer (SerDes) for KeyStone II Devices User Guide (Rev. A) 2016. 7. 27
애플리케이션 노트 Power Management of KS2 Device (Rev. C) 2016. 7. 15
애플리케이션 노트 Throughput Performance Guide for KeyStone II Devices (Rev. B) 2015. 12. 22
애플리케이션 노트 Keystone II DDR3 Debug Guide 2015. 10. 16
사용 설명서 Enhanced Direct memory Access 3 (EDMA3) for KeyStone Devices User's Guide (Rev. B) PDF | HTML 2015. 5. 6
사용 설명서 Gigabit Ethernet (GbE) Switch SS for K2E & K2L Devices User's Guide (Rev. A) 2015. 4. 28
사용 설명서 Multicore Navigator (CPPI) for KeyStone Architecture User's Guide (Rev. H) PDF | HTML 2015. 4. 9
사용 설명서 DDR3 Memory Controller for KeyStone II Devices User's Guide (Rev. C) 2015. 3. 27
백서 Save power and costs with TI's K2E on-chip networking features 2015. 3. 25
애플리케이션 노트 Keystone II DDR3 Initialization 2015. 1. 26
사용 설명서 Power Sleep Controller (PSC) for KeyStone Devices User's Guide (Rev. C) 2014. 9. 4
백서 KeyStone™-II-based processors: 10G Ethernet as an optical interface 2014. 8. 25
사용 설명서 Security Accelerator 2 (SA2) for K2E and K2L Devices User's Guide 2014. 8. 19
사용 설명서 Packet Accelerator 2 (PA2) for K2E and K2L Devices User's Guide 2014. 8. 19
백서 Differentiating AM5K2E02 and AM5K2E04 SoCs from Alternate ARM® Cortex®-A15 Devic 2014. 8. 14
사용 설명서 Network Coprocessor (NETCP) for K2E and K2L Devices User's Guide 2014. 8. 13
애플리케이션 노트 Hardware Design Guide for KeyStone II Devices 2014. 3. 24
사용 설명서 PCI Express (PCIe) for KeyStone Devices User's Guide (Rev. D) 2013. 9. 30
사용 설명서 Debug and Trace for KeyStone II Devices User's Guide 2013. 7. 26
사용 설명서 ARM Bootloader User Guide for KeyStone II Devices 2013. 7. 21
사용 설명서 Memory Protection Unit (MPU) for KeyStone Devices User's Guide (Rev. A) 2013. 6. 28
사용 설명서 HyperLink for KeyStone Devices User's Guide (Rev. C) 2013. 5. 28
사용 설명서 Multicore Shared Memory Controller (MSMC) User Guide for KeyStone II Devices 2012. 11. 12
Product overview Industrial Imaging: Applications of the K2H and K2E platforms 2012. 11. 9
Product overview Video Infrastructure - Applications of the K2E, K2H platforms 2012. 11. 9
Product overview OpenMP Programming for TMS320C66x Multicore DSPs (Rev. A) 2012. 11. 5
사용 설명서 ARM CorePac User Guide for KeyStone II Devices 2012. 10. 31
애플리케이션 노트 Multicore Programming Guide (Rev. B) 2012. 8. 29
사용 설명서 Serial Peripheral Interface (SPI) for KeyStone Devices User’s Guide (Rev. A) 2012. 3. 30
사용 설명서 Chip Interrupt Controller (CIC) for KeyStone Devices User's Guide (Rev. A) 2012. 3. 27
사용 설명서 64-Bit Timer (Timer64) for KeyStone Devices User's Guide (Rev. A) 2012. 3. 22
애플리케이션 노트 PCIe Use Cases for KeyStone Devices 2011. 12. 13
사용 설명서 Inter-Integrated Circuit (I2C) for KeyStone Devices User's Guide 2011. 9. 2
사용 설명서 External Memory Interface (EMIF16) for KeyStone Devices User's Guide (Rev. A) 2011. 5. 24
애플리케이션 노트 Optimizing Loops on the C66x DSP 2010. 11. 9
사용 설명서 General-Purpose Input/Output (GPIO) forKeyStone Devices User's Guide 2010. 11. 9
애플리케이션 노트 Clocking Design Guide for KeyStone Devices 2010. 11. 9
사용 설명서 Universal Asynchronous Receiver/Transmitter (UART) for KeyStone Devices UG 2010. 11. 9
사용 설명서 C66x DSP Cache User's Guide 2010. 11. 9
사용 설명서 Telecom Serial Interface Port (TSIP) for KeyStone Devices User's Guide 2010. 11. 9

주문 및 품질

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

비디오 시리즈

모든 비디오 보기

동영상