DS90CR288A
- 20 to 85 MHz Shift Clock Support
- 50% Duty Cycle on Receiver Output Clock
- 2.5 / 0 ns Set & Hold Times on TxINPUTs
- Low Power Consumption
- ±1V Common-Mode Range (around +1.2V)
- Narrow Bus Reduces Cable Size and Cost
- Up to 2.38 Gbps Throughput
- Up to 297.5 Mbytes/sec Bandwidth
- 345 mV (typ) Swing LVDS Devices for Low EMI
- PLL Requires no External Components
- Rising Edge Data Strobe
- Compatible with TIA/EIA-644 LVDS Standard
- Low Profile 56-Lead TSSOP Package
The DS90CR287 transmitter converts 28 bits of LVCMOS/LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted.
The DS90CR288A receiver converts the four LVDS data streams back into 28 bits of LVCMOS/LVTTL data. At a transmit clock frequency of 85 MHz, 28 bits of TTL data are transmitted at a rate of 595 Mbps per LVDS data channel. Using a 85 MHz clock, the data throughput is 2.38 Gbit/s (297.5 Mbytes/sec).
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high-speed TTL interfaces.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | DS90CR287/DS90CR288A 3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link 85MHz datasheet (Rev. G) | 2013. 3. 5 | ||
| 애플리케이션 노트 | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018. 11. 9 | |||
| 애플리케이션 노트 | Receiver Skew Margin for Channel Link I and FPD Link I Devices | PDF | HTML | 2016. 1. 13 | ||
| 설계 가이드 | Channel Link I Design Guide | 2007. 3. 29 | |||
| 애플리케이션 노트 | Multi-Drop Channel-Link Operation | 2004. 10. 4 | |||
| 애플리케이션 노트 | CHANNEL LINK Moving and Shaping Information In Point-To-Point Applications | 1998. 10. 5 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
FLINK3V8BT-85 — 시리얼라이저 및 디시리얼라이저 LVDS 장치의 FPD-Link 제품군용 평가 키트
The FPD-Link evaluation kit includes a transmitter (Tx) board, a receiver (Rx) board and interfacing cables. This kit shows the chipsets interfacing from test equipment or a graphics controller using low-voltage differential signaling (LVDS) to a receiver board.
The transmitter board accepts (...)
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| TSSOP (DGG) | 56 | Ultra Librarian |
주문 및 품질
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.