홈 마이크로컨트롤러(MCU) 및 프로세서 Arm 기반 프로세서
홈
마이크로컨트롤러(MCU) 및 프로세서
Arm 기반 프로세서

OMAPL137-HT

활성

고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz

지금 주문
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정오표

OMAPL137-HT

활성
데이터시트 지금 주문

제품 상세 정보

Arm CPU 1 Arm9 Arm (max) (MHz) 300 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection Rating High Temp Power supply solution TPS65910 Operating temperature range (°C) -55 to 175
Arm CPU 1 Arm9 Arm (max) (MHz) 300 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection Rating High Temp Power supply solution TPS65910 Operating temperature range (°C) -55 to 175
DIESALE (KGD) — See data sheet HLQFP (PTP) 176 676 mm² 26 x 26
  • Highlights
    • Dual Core SoC300-MHz ARM926EJ-S RISC MPU300-MHz C674x™ VLIW DSP
    • TMS320C674x Fixed/Floating-Point VLIW DSP Core
    • Enhanced Direct-Memory-Access Controller 3 (EDMA3)
    • 128K-Byte RAM Shared Memory
    • Two External Memory Interfaces
    • Two External Memory Interfaces Modules
    • LCD Controller
    • Two Serial Peripheral Interfaces (SPI)
    • Multimedia Card (MMC)/Secure Digital (SD)
    • Two Master/Slave Inter-Integrated Circuit
    • One Host-Port Interface (HPI)
    • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
  • Applications
    • Industrial Diagnostics
    • Test and measurement
    • Military Sonar/Radar
    • Medical measurement
    • Professional Audio
    • Down Hole Industry
  • Software Support
    • TI DSP/BIOS
    • Chip Support Library and DSP Library
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM Jazelle Technology
    • EmbeddedICE-RT for Real-Time Debug
  • ARM9 Memory Architecture
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 3648/2736 C674x MIPS/MFLOPS
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two Level Cache Memory Architecture
    • 32K-Byte L1P Program RAM/Cache
    • 32K-Byte L1D Data RAM/Cache
    • 256K-Byte L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
    • 1024KB L2 ROM
  • Enhanced Direct-Memory-Access Controller 3 (EDMA3):
    • 2 Transfer Controllers
    • 32 Independent DMA Channels
    • 8 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x™ Fixed/Floating-Point VLIW DSP Core
    • Load-Store Architecture With Non-Aligned Support
    • 64 General-Purpose Registers (32 Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and
        DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions
        Every 2 Clocks
      • Supports up to Two Floating Point (SP or DP) Approximate Reciprocal
        or Square Root Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point Multiply Supported up to:
        • 2 SP × SP > SP Per Clock
        • 2 SP × SP > DP Every Two Clocks
        • 2 SP × DP > DP Every Three Clocks
        • 2 DP × DP > DP Every Four Clocks
        • Fixed Point Multiply Supports Two 32 × 32-Bit Multiplies,
          Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies
          per Clock Cycle, and Complex Multiples
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Hardware Support for Modulo Loop Operation
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
    • 128K-Byte RAM Shared Memory
    • 3.3V LVCMOS IOs (except for USB interfaces)
    • Two External Memory Interfaces:
      • EMIFA
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
        • 16-Bit SDRAM With 128MB Address Space
      • EMIFB
        • 32-Bit or 16-Bit SDRAM With 256MB Address Space
    • Three Configurable 16550 type UART Modules:
      • UART0 With Modem Control Signals
      • Autoflow control signals (CTS, RTS) on UART0 only
      • 16-byte FIFO
      • 16x or 13x Oversampling Option
    • LCD Controller
    • Two Serial Peripheral Interfaces (SPI) Each With One Chip-Select
    • Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
    • Two Master/Slave Inter-Integrated Circuit (I2CBus™)
    • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address/Data Bus For High Bandwidth
    • Programmable Real-Time Unit Subsystem (PRUSS)
      • Two Independent Programmable Realtime Unit (PRU) Cores
        • 32-Bit Load/Store RISC architecture
        • 4K Byte instruction RAM per core
        • 512 Bytes data RAM per core
        • PRU Subsystem (PRUSS) can be disabled via software to save power
      • Standard Power Management Mechanism
        • Clock Gating
        • Entire Subsystem Under a Single PSC Clock Gating Domain
        • Dedicated Interrupt Controller
        • Dedicated Switched Central Resource
      • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
      • USB 2.0 OTG Port With Integrated PHY (USB0):
        • USB 2.0 High-/Full-Speed Client
        • USB 2.0 High-/Full-/Low-Speed Host
        • End Point 0 (Control)
        • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) Rx and Tx
      • Three Multichannel Audio Serial Ports:
        • Six Clock Zones and 28 Serial Data Pins
        • Supports TDM, I2S, and Similar Formats
        • DIT-Capable (McASP2)
        • FIFO buffers for Transmit and Receive
      • 10/100 Mb/s Ethernet MAC (EMAC):
        • IEEE 802.3 Compliant (3.3-V I/O Only)
        • RMII Media Independent Interface
        • Management Data I/O (MDIO) Module
      • Real-Time Clock With 32 KHz Oscillator and Separate Power Rail
      • Crystal oscillators not validated beyond 125°C. Recommend use of external oscillator.
      • One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
      • One 64-Bit General-Purpose Timer/Watchdog Timer (Configurable as Two 32-bit
        General-Purpose Timers)
      • Three Enhanced Pulse Width Modulators (eHRPWM):
        • Dedicated 16-Bit Time-Base Counter With Period And Frequency Control
        • 6 Single Edge, 6 Dual Edge Symmetric or 3 Dual Edge Asymmetric Outputs
        • Dead-Band Generation
        • PWM Chopping by High-Frequency Carrier
        • Trip Zone Input
      • Three 32-Bit Enhanced Capture Modules (eCAP):
        • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) outputs
        • Single Shot Capture of up to Four Event Time-Stamps
      • Two 32-Bit Enhanced Quadrature Encoder Pulse Modules (eQEP)
      • 176-pin PowerPADTM Plastic Quad Flat Pack [PTP suffix], 0.5-mm Pin Pitch
      • High Temperature (175°C) Application
      • Texas Instruments High Temperature Products Use Highly Optimized Silicon Solutions with
        Design and Process Enhancements to Maximize Performance over Extended Temperatures.
        All Devices are Characterized and Qualified for 1000 Hours Continuous Operating Life
        at Maximum Rated Temperature
      • Community Resources
        • TI E2E Community
        • TI Embedded Processors Wiki
  • Highlights
    • Dual Core SoC300-MHz ARM926EJ-S RISC MPU300-MHz C674x™ VLIW DSP
    • TMS320C674x Fixed/Floating-Point VLIW DSP Core
    • Enhanced Direct-Memory-Access Controller 3 (EDMA3)
    • 128K-Byte RAM Shared Memory
    • Two External Memory Interfaces
    • Two External Memory Interfaces Modules
    • LCD Controller
    • Two Serial Peripheral Interfaces (SPI)
    • Multimedia Card (MMC)/Secure Digital (SD)
    • Two Master/Slave Inter-Integrated Circuit
    • One Host-Port Interface (HPI)
    • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
  • Applications
    • Industrial Diagnostics
    • Test and measurement
    • Military Sonar/Radar
    • Medical measurement
    • Professional Audio
    • Down Hole Industry
  • Software Support
    • TI DSP/BIOS
    • Chip Support Library and DSP Library
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM Jazelle Technology
    • EmbeddedICE-RT for Real-Time Debug
  • ARM9 Memory Architecture
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 3648/2736 C674x MIPS/MFLOPS
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two Level Cache Memory Architecture
    • 32K-Byte L1P Program RAM/Cache
    • 32K-Byte L1D Data RAM/Cache
    • 256K-Byte L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
    • 1024KB L2 ROM
  • Enhanced Direct-Memory-Access Controller 3 (EDMA3):
    • 2 Transfer Controllers
    • 32 Independent DMA Channels
    • 8 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x™ Fixed/Floating-Point VLIW DSP Core
    • Load-Store Architecture With Non-Aligned Support
    • 64 General-Purpose Registers (32 Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and
        DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions
        Every 2 Clocks
      • Supports up to Two Floating Point (SP or DP) Approximate Reciprocal
        or Square Root Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point Multiply Supported up to:
        • 2 SP × SP > SP Per Clock
        • 2 SP × SP > DP Every Two Clocks
        • 2 SP × DP > DP Every Three Clocks
        • 2 DP × DP > DP Every Four Clocks
        • Fixed Point Multiply Supports Two 32 × 32-Bit Multiplies,
          Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies
          per Clock Cycle, and Complex Multiples
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Hardware Support for Modulo Loop Operation
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
    • 128K-Byte RAM Shared Memory
    • 3.3V LVCMOS IOs (except for USB interfaces)
    • Two External Memory Interfaces:
      • EMIFA
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
        • 16-Bit SDRAM With 128MB Address Space
      • EMIFB
        • 32-Bit or 16-Bit SDRAM With 256MB Address Space
    • Three Configurable 16550 type UART Modules:
      • UART0 With Modem Control Signals
      • Autoflow control signals (CTS, RTS) on UART0 only
      • 16-byte FIFO
      • 16x or 13x Oversampling Option
    • LCD Controller
    • Two Serial Peripheral Interfaces (SPI) Each With One Chip-Select
    • Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
    • Two Master/Slave Inter-Integrated Circuit (I2CBus™)
    • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address/Data Bus For High Bandwidth
    • Programmable Real-Time Unit Subsystem (PRUSS)
      • Two Independent Programmable Realtime Unit (PRU) Cores
        • 32-Bit Load/Store RISC architecture
        • 4K Byte instruction RAM per core
        • 512 Bytes data RAM per core
        • PRU Subsystem (PRUSS) can be disabled via software to save power
      • Standard Power Management Mechanism
        • Clock Gating
        • Entire Subsystem Under a Single PSC Clock Gating Domain
        • Dedicated Interrupt Controller
        • Dedicated Switched Central Resource
      • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
      • USB 2.0 OTG Port With Integrated PHY (USB0):
        • USB 2.0 High-/Full-Speed Client
        • USB 2.0 High-/Full-/Low-Speed Host
        • End Point 0 (Control)
        • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) Rx and Tx
      • Three Multichannel Audio Serial Ports:
        • Six Clock Zones and 28 Serial Data Pins
        • Supports TDM, I2S, and Similar Formats
        • DIT-Capable (McASP2)
        • FIFO buffers for Transmit and Receive
      • 10/100 Mb/s Ethernet MAC (EMAC):
        • IEEE 802.3 Compliant (3.3-V I/O Only)
        • RMII Media Independent Interface
        • Management Data I/O (MDIO) Module
      • Real-Time Clock With 32 KHz Oscillator and Separate Power Rail
      • Crystal oscillators not validated beyond 125°C. Recommend use of external oscillator.
      • One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
      • One 64-Bit General-Purpose Timer/Watchdog Timer (Configurable as Two 32-bit
        General-Purpose Timers)
      • Three Enhanced Pulse Width Modulators (eHRPWM):
        • Dedicated 16-Bit Time-Base Counter With Period And Frequency Control
        • 6 Single Edge, 6 Dual Edge Symmetric or 3 Dual Edge Asymmetric Outputs
        • Dead-Band Generation
        • PWM Chopping by High-Frequency Carrier
        • Trip Zone Input
      • Three 32-Bit Enhanced Capture Modules (eCAP):
        • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) outputs
        • Single Shot Capture of up to Four Event Time-Stamps
      • Two 32-Bit Enhanced Quadrature Encoder Pulse Modules (eQEP)
      • 176-pin PowerPADTM Plastic Quad Flat Pack [PTP suffix], 0.5-mm Pin Pitch
      • High Temperature (175°C) Application
      • Texas Instruments High Temperature Products Use Highly Optimized Silicon Solutions with
        Design and Process Enhancements to Maximize Performance over Extended Temperatures.
        All Devices are Characterized and Qualified for 1000 Hours Continuous Operating Life
        at Maximum Rated Temperature
      • Community Resources
        • TI E2E Community
        • TI Embedded Processors Wiki

The OMAPL137 is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.

The OMAPL137 enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the OMAPL137 provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and 16Kbyte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core also has a 8KB RAM (Vector Table) and 64KB ROM.

The OMAPL137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; two inter-integrated circuit (I2C) bus interfaces; 3 multichannel audio serial ports (McASP) with 16/12/4 serializers and FIFO buffers; 2 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host port interface (HPI) ; up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with RTS and CTS); 3 enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; 2 32-bit enhanced quadrature pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is available for PHY configuration.

The HPI, I2C, SPI, USB1.1 and USB2.0 ports allow the device to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

The OMAPL137 is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.

The OMAPL137 enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the OMAPL137 provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and 16Kbyte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core also has a 8KB RAM (Vector Table) and 64KB ROM.

The OMAPL137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; two inter-integrated circuit (I2C) bus interfaces; 3 multichannel audio serial ports (McASP) with 16/12/4 serializers and FIFO buffers; 2 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host port interface (HPI) ; up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with RTS and CTS); 3 enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; 2 32-bit enhanced quadrature pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is available for PHY configuration.

The HPI, I2C, SPI, USB1.1 and USB2.0 ports allow the device to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.
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모두 보기7
유형 직함 날짜
* Data sheet Low-Power Applications Processor datasheet (Rev. B) 2013/02/08
* Errata OMAP-L137 C6000 DSP+ARM Processor Errata (Silicon Revs 3.0, 2.1, 2.0, 1.1 & 1.0) (Rev. I) 2014/06/17
* Radiation & reliability report OMAPL137PTPH Reliability Report (Rev. A) 2012/08/17
Application note Processor SDK RTOS Audio Benchmark Starter Kit 2017/04/12
User guide OMAP-L137 C6000 DSP+ARM Processor Technical Reference Manual (Rev. D) 2016/09/21
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 2011/05/19

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제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz TMS320DM8127 — DaVinci 디지털 미디어 프로세서
DSP(디지털 신호 프로세서)
SM320C6201-EP — 향상된 제품 C6201 고정 소수점 DSP SM320C6415 — 군사용 등급 C64x 고정 소수점 DSP SM320C6415-EP — 향상된 제품 C6415 고정 소수점 DSP SM320C6424-EP — EP(Enhanced Product) C6424 고정 소수점 DSP SM320C6455-EP — EP(Enhanced Product) C6455 고정 소수점 DSP SM320C6472-HIREL — 높은 안정성 제품 6 코어 C6472 고정 소수점 DSP SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP SM320C6701 — 군사용 애플리케이션을 위한 단일 코어 C67x 부동 소수점 DSP - 최대 167MHz SM320C6701-EP — 향상된 제품 C6701 부동 소수점 DSP SM320C6711D-EP — 향상된 제품 C6711D 부동 소수점 DSP SM320C6712D-EP — 향상된 제품 C6712D DSP SM320C6713B-EP — 향상된 제품 C6713 부동 소수점 DSP SM320C6727B — 군사용 등급 C6727B 부동 소수점 DSP SM320C6727B-EP — 향상된 제품 C6727 부동 소수점 DSP SM320DM642-HIREL — 높은 안정성 제품 디지털 미디어 DM642 DSP SM32C6416T-EP — 향상된 제품 C6416T 고정 소수점 DSP SMJ320C6201B — 고정 소수점 디지털 신호 프로세서, 군사용 SMJ320C6203 — 군사용 등급 C62x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6415 — 군사용 등급 C64x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6701 — 군사용 등급 C67x 부동 소수점 DSP - 세라믹 패키지 SMJ320C6701-SP — 우주 항공 등급 C6701 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V SMV320C6727B-SP — 우주 항공 등급 C6727B 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V TMS320C6201 — 고정소수점 디지털 신호 프로세서 TMS320C6202 — 고정소수점 디지털 신호 프로세서 TMS320C6202B — C62x 고정 소수점 DSP - 최대 300MHz, 384KB TMS320C6203B — C62x 고정 소수점 DSP - 최대 300MHz, 896KB TMS320C6204 — 고정소수점 디지털 신호 프로세서 TMS320C6205 — 고정소수점 디지털 신호 프로세서 TMS320C6211B — C62x 고정 소수점 DSP - 최대 167MHz TMS320C6421Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 8비트 EMIFA, 16비트 DDR2 TMS320C6424Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 16/8비트 EMIFA, 32/16비트 DDR2 TMS320C6452 — C64x+ 고정 소수점 DSP - 최대 900MHz, 1Gbps 이더넷 TMS320C6454 — C64x+ 고정 소수점 DSP - 최대 1GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6455 — C64x+ 고정 소수점 DSP - 최대 1.2GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6457 — 통신 인프라 디지털 신호 프로세서 TMS320C6701 — C67x 부동 소수점 DSP - 최대 167MHz, McBSP TMS320C6711D — C67x 부동 소수점 DSP - 최대 250MHz, McBSP, 32비트 EMIFA TMS320C6712D — C67x 부동 소수점 DSP - 최대 150MHz, McBSP, 16비트 EMIFA TMS320C6720 — C67x 부동 소수점 DSP - 200MHz, McASP, 16비트 EMIFA TMS320C6722B — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 16비트 EMIFA TMS320C6726B — C67x 부동 소수점 DSP - 최대 266MHz, McASP, 16비트 EMIFA TMS320C6727 — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 32비트 EMIFA TMS320C6727B — C67x 부동 소수점 DSP - 최대 350MHz, McASP, 32비트 EMIFA TMS320C6743 — 저전력 C674x 부동 소수점 DSP - 375MHz TMS320C6745 — 저전력 C674x 부동 소수점 DSP - 456MHz, QFP TMS320C6747 — 저전력 C674x 부동 소수점 DSP - 456MHz, PBGA
다운로드
드라이버 또는 라이브러리

C67X-DSPLIB — Download TMS320C67x DSP Library

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz TMS320DM8127 — DaVinci 디지털 미디어 프로세서
DSP(디지털 신호 프로세서)
SM320C6201-EP — 향상된 제품 C6201 고정 소수점 DSP SM320C6415 — 군사용 등급 C64x 고정 소수점 DSP SM320C6415-EP — 향상된 제품 C6415 고정 소수점 DSP SM320C6424-EP — EP(Enhanced Product) C6424 고정 소수점 DSP SM320C6455-EP — EP(Enhanced Product) C6455 고정 소수점 DSP SM320C6472-HIREL — 높은 안정성 제품 6 코어 C6472 고정 소수점 DSP SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP SM320C6701 — 군사용 애플리케이션을 위한 단일 코어 C67x 부동 소수점 DSP - 최대 167MHz SM320C6701-EP — 향상된 제품 C6701 부동 소수점 DSP SM320C6711D-EP — 향상된 제품 C6711D 부동 소수점 DSP SM320C6712D-EP — 향상된 제품 C6712D DSP SM320C6713B-EP — 향상된 제품 C6713 부동 소수점 DSP SM320C6727B — 군사용 등급 C6727B 부동 소수점 DSP SM320C6727B-EP — 향상된 제품 C6727 부동 소수점 DSP SM320DM642-HIREL — 높은 안정성 제품 디지털 미디어 DM642 DSP SM32C6416T-EP — 향상된 제품 C6416T 고정 소수점 DSP SMJ320C6201B — 고정 소수점 디지털 신호 프로세서, 군사용 SMJ320C6203 — 군사용 등급 C62x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6415 — 군사용 등급 C64x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6701 — 군사용 등급 C67x 부동 소수점 DSP - 세라믹 패키지 SMJ320C6701-SP — 우주 항공 등급 C6701 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V SMV320C6727B-SP — 우주 항공 등급 C6727B 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V TMS320C6201 — 고정소수점 디지털 신호 프로세서 TMS320C6202 — 고정소수점 디지털 신호 프로세서 TMS320C6202B — C62x 고정 소수점 DSP - 최대 300MHz, 384KB TMS320C6203B — C62x 고정 소수점 DSP - 최대 300MHz, 896KB TMS320C6204 — 고정소수점 디지털 신호 프로세서 TMS320C6205 — 고정소수점 디지털 신호 프로세서 TMS320C6211B — C62x 고정 소수점 DSP - 최대 167MHz TMS320C6421Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 8비트 EMIFA, 16비트 DDR2 TMS320C6424Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 16/8비트 EMIFA, 32/16비트 DDR2 TMS320C6452 — C64x+ 고정 소수점 DSP - 최대 900MHz, 1Gbps 이더넷 TMS320C6454 — C64x+ 고정 소수점 DSP - 최대 1GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6455 — C64x+ 고정 소수점 DSP - 최대 1.2GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6457 — 통신 인프라 디지털 신호 프로세서 TMS320C6701 — C67x 부동 소수점 DSP - 최대 167MHz, McBSP TMS320C6711D — C67x 부동 소수점 DSP - 최대 250MHz, McBSP, 32비트 EMIFA TMS320C6712D — C67x 부동 소수점 DSP - 최대 150MHz, McBSP, 16비트 EMIFA TMS320C6720 — C67x 부동 소수점 DSP - 200MHz, McASP, 16비트 EMIFA TMS320C6722B — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 16비트 EMIFA TMS320C6726B — C67x 부동 소수점 DSP - 최대 266MHz, McASP, 16비트 EMIFA TMS320C6727 — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 32비트 EMIFA TMS320C6727B — C67x 부동 소수점 DSP - 최대 350MHz, McASP, 32비트 EMIFA TMS320C6743 — 저전력 C674x 부동 소수점 DSP - 375MHz TMS320C6745 — 저전력 C674x 부동 소수점 DSP - 456MHz, QFP TMS320C6747 — 저전력 C674x 부동 소수점 DSP - 456MHz, PBGA
다운로드
드라이버 또는 라이브러리

C67X-MATHLIB — DSP Math Library for C67x Floating Point Devices

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz
DSP(디지털 신호 프로세서)
DM505 — 비전 분석용 SoC 15mm 패키지 SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP SM320C6727B — 군사용 등급 C6727B 부동 소수점 DSP SM320C6727B-EP — 향상된 제품 C6727 부동 소수점 DSP SMV320C6727B-SP — 우주 항공 등급 C6727B 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V TMS320C6701 — C67x 부동 소수점 DSP - 최대 167MHz, McBSP TMS320C6711D — C67x 부동 소수점 DSP - 최대 250MHz, McBSP, 32비트 EMIFA TMS320C6712D — C67x 부동 소수점 DSP - 최대 150MHz, McBSP, 16비트 EMIFA TMS320C6720 — C67x 부동 소수점 DSP - 200MHz, McASP, 16비트 EMIFA TMS320C6722B — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 16비트 EMIFA TMS320C6726B — C67x 부동 소수점 DSP - 최대 266MHz, McASP, 16비트 EMIFA TMS320C6727 — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 32비트 EMIFA TMS320C6727B — C67x 부동 소수점 DSP - 최대 350MHz, McASP, 32비트 EMIFA TMS320C6743 — 저전력 C674x 부동 소수점 DSP - 375MHz TMS320C6745 — 저전력 C674x 부동 소수점 DSP - 456MHz, QFP TMS320C6747 — 저전력 C674x 부동 소수점 DSP - 456MHz, PBGA
다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.
시작 다운로드 옵션
소프트웨어 코덱

C66XCODECSPCH — C66x Speech Codecs - Software and Documentation

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz SMOMAPL138B-HIREL — 고신뢰성 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 375MHz
DSP(디지털 신호 프로세서)
DM505 — 비전 분석용 SoC 15mm 패키지 SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP
다운로드 옵션
소프트웨어 코덱

C66XCODECSVID — C6678 Video Codecs - Software and Documentation

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz SMOMAPL138B-HIREL — 고신뢰성 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 375MHz
DSP(디지털 신호 프로세서)
DM505 — 비전 분석용 SoC 15mm 패키지 SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP
다운로드 옵션
설계 툴

PROCESSORS-3P-SEARCH — Arm 기반 MPU, arm 기반 MCU 및 DSP 타사 검색 툴

TI는 여러 회사와의 협력을 통해 TI 프로세서를 사용하여 광범위한 소프트웨어, 툴 및 SOM을 제공해서 생산 단계로 가는 속도를 높이고 있습니다. 이 검색 툴을 다운로드하여 타사 솔루션을 빠르게 검색하고 필요에 맞는 올바른 타사를 찾아보세요. 여기에 나열된 소프트웨어, 툴 및 모듈은 텍사스 인스트루먼트가 아닌 독립적인 타사에서 생산 및 관리하고 있습니다.

검색 툴은 다음과 같이 제품 유형별로 분류되어 있습니다.

  • 툴에는 IDE/컴파일러, 디버그 및 추적, 시뮬레이션 및 모델링 소프트웨어, 플래시 프로그래머가 포함되어 있습니다.
  • OS에는 (...)
다운로드
패키지 핀 다운로드
DIESALE (KGD) —
HLQFP (PTP) 176 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

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