홈 마이크로컨트롤러(MCU) 및 프로세서 Arm 기반 프로세서
홈
마이크로컨트롤러(MCU) 및 프로세서
Arm 기반 프로세서

OMAPL138B-EP

활성

향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz

지금 주문
데이터시트
정오표

OMAPL138B-EP

활성
데이터시트 지금 주문

제품 상세 정보

Arm CPU 1 Arm9 Arm (max) (MHz) 345 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection, Secure boot Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Arm CPU 1 Arm9 Arm (max) (MHz) 345 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection, Secure boot Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
NFBGA (GWT) 361 256 mm² 16 x 16
  • Highlights
    • Dual Core SoC
      • 345-MHz ARM926EJ-S™ RISC MPU
      • 345-MHz C674x Fixed/Floating-Point VLIW DSP
    • Supports TI’s Basic Secure Boot
    • Enhanced Direct-Memory-Access Controller (EDMA3)
    • Serial ATA (SATA) Controller
    • DDR2/Mobile DDR Memory Controller
    • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interface
    • LCD Controller
    • Video Port Interface (VPIF)
    • 10/100 Mb/s Ethernet MAC (EMAC)
    • Programmable Real-Time Unit Subsystem
    • Three Configurable UART Modules
    • USB 1.1 OHCI (Host) With Integrated PHY
    • One Multichannel Audio Serial Port
    • Two Multichannel Buffered Serial Ports
  • Dual Core SoC
    • 345-MHz ARM926EJ-S™ RISC MPU
    • 345-MHz C674x Fixed/Floating-Point VLIW DSP
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 16K-Byte Data Cache
    • 8K-Byte RAM (Vector Table)
    • 64K-Byte ROM
  • C674x™ Instruction Set Features
    • Superset of the C67x+™ and C64x+™ ISAs
    • Up to 3648/2746 C674x MIPS/MFLOPS
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two Level Cache Memory Architecture
    • 32K-Byte L1P Program RAM/Cache
    • 32K-Byte L1D Data RAM/Cache
    • 256K-Byte L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct-Memory-Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Non-Aligned Support
    • 64 General-Purpose Registers (32 Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit)
        and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP
        Additions Every 2 Clocks
      • Supports up to Two Floating Point (SP or DP)
        Reciprocal Approximation (RCPxP) and Square-Root Reciprocal
        Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point
        Multiply Supported up to:
        • 2 SP x SP → SP Per Clock
        • 2 SP x SP → DP Every Two Clocks
        • 2 SP x DP → DP Every Three Clocks
        • 2 DP x DP → DP Every Four Clocks
      • Fixed Point Multiply Supports Two 32 × 32-Bit Multiplies,
        Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit
        Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSP/BIOS™
    • Chip Support Library and DSP Library
  • 128K-Byte RAM Shared Memory
  • 1.8V or 3.3V LVCMOS IOs (except for USB and DDR2 interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8-/16-Bit-Wide Data)
      • NAND (8-/16-Bit-Wide Data)
      • 16-Bit SDRAM With 128 MB Address Space
    • DDR2/Mobile DDR Memory Controller
      • 16-Bit DDR2 SDRAM With 512 MB Address Space or
      • 16-Bit mDDR SDRAM With 256 MB Address Space
    • Three Configurable 16550 type UART Modules:
      • With Modem Control Signals
      • 16-byte FIFO
      • 16x or 13x Oversampling Option
    • LCD Controller
    • Two Serial Peripheral Interfaces (SPI) Each With Multiple Chip-Selects
    • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interface with
      Secure Data I/O (SDIO) Interfaces
    • Two Master/Slave Inter-Integrated Circuit (I2C Bus™)
    • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address/Data Bus
      For High Bandwidth
    • Programmable Real-Time Unit Subsystem (PRUSS)
      • Two Independent Programmable Realtime Unit (PRU) Cores
        • 32-Bit Load/Store RISC architecture
        • 4K Byte instruction RAM per core
        • 512 Bytes data RAM per core
        • PRU Subsystem (PRUSS) can be disabled via software to save power
        • Register 30 of each PRU is exported from the subsystem in addition to the
          normal R31 output of the PRU cores.
      • Standard power management mechanism
        • Clock gating
        • Entire subsystem under a single PSC clock gating domain
      • Dedicated interrupt controller
      • Dedicated switched central resource
    • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
    • USB 2.0 OTG Port With Integrated PHY (USB0)
      • USB 2.0 High-/Full-Speed Client
      • USB 2.0 High-/Full-/Low-Speed Host
      • End Point 0 (Control)
      • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) Rx and Tx
    • One Multichannel Audio Serial Port:
      • Two Clock Zones and 16 Serial Data Pins
      • Supports TDM, I2S, and Similar Formats
      • DIT-Capable
      • FIFO buffers for Transmit and Receive
    • Two Multichannel Buffered Serial Ports:
      • Supports TDM, I2S, and Similar Formats
      • AC97 Audio Codec Interface
      • Telecom Interfaces (ST-Bus, H100)
      • 128-channel TDM
      • FIFO buffers for Transmit and Receive
    • 10/100 Mb/s Ethernet MAC (EMAC):
      • IEEE 802.3 Compliant
      • MII Media Independent Interface
      • RMII Reduced Media Independent Interface
      • Management Data I/O (MDIO) Module
    • Video Port Interface (VPIF):
      • Two 8-bit SD (BT.656), Single 16-bit or Single Raw (8-/10-/12-bit)
        Video Capture Channels
      • Two 8-bit SD (BT.656), Single 16-bit Video Display Channels
    • Universal Parallel Port (uPP):
      • High-Speed Parallel Interface to FPGAs and Data Converters
      • Data Width on Each of Two Channels is 8- to 16-bit Inclusive
      • Single Data Rate or Dual Data Rate Transfers
      • Supports Multiple Interfaces with START, ENABLE and WAIT Controls
    • Serial ATA (SATA) Controller:
      • Supports SATA I (1.5 Gbps) and SATA II (3.0 Gbps)
      • Supports all SATA Power Management Features
      • Hardware-Assisted Native Command Queueing (NCQ) for up to 32 Entries
      • Supports Port Multiplier and Command-Based Switching
    • Real-Time Clock With 32 KHz Oscillator(1) and Separate Power Rail
    • Three 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
    • One 64-bit General-Purpose/Watchdog Timer (Configurable as Two 32-bit General-Purpose Timers)
    • Two Enhanced Pulse Width Modulators (eHRPWM):
      • Dedicated 16-Bit Time-Base Counter With Period And Frequency Control
      • 6 Single Edge, 6 Dual Edge Symmetric or 3 Dual Edge Asymmetric Outputs
      • Dead-Band Generation
      • PWM Chopping by High-Frequency Carrier
      • Trip Zone Input
    • Three 32-Bit Enhanced Capture Modules (eCAP):
      • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) outputs
      • Single Shot Capture of up to Four Event Time-Stamps
    • 361-Ball SnPb Plastic Ball Grid Array (PBGA) [GWT Suffix], 0.80-mm Ball Pitch
    • Available in Military (-55°C to 125°C) Temperature Range

    Supports Defense, Aerospace, and Medical Applications

    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Extended (–55°C/125°C) Temperature Range
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

    (1) Crystal oscillator cannot be operated beyond 105°C.
  • Highlights
    • Dual Core SoC
      • 345-MHz ARM926EJ-S™ RISC MPU
      • 345-MHz C674x Fixed/Floating-Point VLIW DSP
    • Supports TI’s Basic Secure Boot
    • Enhanced Direct-Memory-Access Controller (EDMA3)
    • Serial ATA (SATA) Controller
    • DDR2/Mobile DDR Memory Controller
    • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interface
    • LCD Controller
    • Video Port Interface (VPIF)
    • 10/100 Mb/s Ethernet MAC (EMAC)
    • Programmable Real-Time Unit Subsystem
    • Three Configurable UART Modules
    • USB 1.1 OHCI (Host) With Integrated PHY
    • One Multichannel Audio Serial Port
    • Two Multichannel Buffered Serial Ports
  • Dual Core SoC
    • 345-MHz ARM926EJ-S™ RISC MPU
    • 345-MHz C674x Fixed/Floating-Point VLIW DSP
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 16K-Byte Data Cache
    • 8K-Byte RAM (Vector Table)
    • 64K-Byte ROM
  • C674x™ Instruction Set Features
    • Superset of the C67x+™ and C64x+™ ISAs
    • Up to 3648/2746 C674x MIPS/MFLOPS
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two Level Cache Memory Architecture
    • 32K-Byte L1P Program RAM/Cache
    • 32K-Byte L1D Data RAM/Cache
    • 256K-Byte L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct-Memory-Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Non-Aligned Support
    • 64 General-Purpose Registers (32 Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit)
        and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP
        Additions Every 2 Clocks
      • Supports up to Two Floating Point (SP or DP)
        Reciprocal Approximation (RCPxP) and Square-Root Reciprocal
        Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point
        Multiply Supported up to:
        • 2 SP x SP → SP Per Clock
        • 2 SP x SP → DP Every Two Clocks
        • 2 SP x DP → DP Every Three Clocks
        • 2 DP x DP → DP Every Four Clocks
      • Fixed Point Multiply Supports Two 32 × 32-Bit Multiplies,
        Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit
        Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSP/BIOS™
    • Chip Support Library and DSP Library
  • 128K-Byte RAM Shared Memory
  • 1.8V or 3.3V LVCMOS IOs (except for USB and DDR2 interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8-/16-Bit-Wide Data)
      • NAND (8-/16-Bit-Wide Data)
      • 16-Bit SDRAM With 128 MB Address Space
    • DDR2/Mobile DDR Memory Controller
      • 16-Bit DDR2 SDRAM With 512 MB Address Space or
      • 16-Bit mDDR SDRAM With 256 MB Address Space
    • Three Configurable 16550 type UART Modules:
      • With Modem Control Signals
      • 16-byte FIFO
      • 16x or 13x Oversampling Option
    • LCD Controller
    • Two Serial Peripheral Interfaces (SPI) Each With Multiple Chip-Selects
    • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interface with
      Secure Data I/O (SDIO) Interfaces
    • Two Master/Slave Inter-Integrated Circuit (I2C Bus™)
    • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address/Data Bus
      For High Bandwidth
    • Programmable Real-Time Unit Subsystem (PRUSS)
      • Two Independent Programmable Realtime Unit (PRU) Cores
        • 32-Bit Load/Store RISC architecture
        • 4K Byte instruction RAM per core
        • 512 Bytes data RAM per core
        • PRU Subsystem (PRUSS) can be disabled via software to save power
        • Register 30 of each PRU is exported from the subsystem in addition to the
          normal R31 output of the PRU cores.
      • Standard power management mechanism
        • Clock gating
        • Entire subsystem under a single PSC clock gating domain
      • Dedicated interrupt controller
      • Dedicated switched central resource
    • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
    • USB 2.0 OTG Port With Integrated PHY (USB0)
      • USB 2.0 High-/Full-Speed Client
      • USB 2.0 High-/Full-/Low-Speed Host
      • End Point 0 (Control)
      • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) Rx and Tx
    • One Multichannel Audio Serial Port:
      • Two Clock Zones and 16 Serial Data Pins
      • Supports TDM, I2S, and Similar Formats
      • DIT-Capable
      • FIFO buffers for Transmit and Receive
    • Two Multichannel Buffered Serial Ports:
      • Supports TDM, I2S, and Similar Formats
      • AC97 Audio Codec Interface
      • Telecom Interfaces (ST-Bus, H100)
      • 128-channel TDM
      • FIFO buffers for Transmit and Receive
    • 10/100 Mb/s Ethernet MAC (EMAC):
      • IEEE 802.3 Compliant
      • MII Media Independent Interface
      • RMII Reduced Media Independent Interface
      • Management Data I/O (MDIO) Module
    • Video Port Interface (VPIF):
      • Two 8-bit SD (BT.656), Single 16-bit or Single Raw (8-/10-/12-bit)
        Video Capture Channels
      • Two 8-bit SD (BT.656), Single 16-bit Video Display Channels
    • Universal Parallel Port (uPP):
      • High-Speed Parallel Interface to FPGAs and Data Converters
      • Data Width on Each of Two Channels is 8- to 16-bit Inclusive
      • Single Data Rate or Dual Data Rate Transfers
      • Supports Multiple Interfaces with START, ENABLE and WAIT Controls
    • Serial ATA (SATA) Controller:
      • Supports SATA I (1.5 Gbps) and SATA II (3.0 Gbps)
      • Supports all SATA Power Management Features
      • Hardware-Assisted Native Command Queueing (NCQ) for up to 32 Entries
      • Supports Port Multiplier and Command-Based Switching
    • Real-Time Clock With 32 KHz Oscillator(1) and Separate Power Rail
    • Three 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
    • One 64-bit General-Purpose/Watchdog Timer (Configurable as Two 32-bit General-Purpose Timers)
    • Two Enhanced Pulse Width Modulators (eHRPWM):
      • Dedicated 16-Bit Time-Base Counter With Period And Frequency Control
      • 6 Single Edge, 6 Dual Edge Symmetric or 3 Dual Edge Asymmetric Outputs
      • Dead-Band Generation
      • PWM Chopping by High-Frequency Carrier
      • Trip Zone Input
    • Three 32-Bit Enhanced Capture Modules (eCAP):
      • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) outputs
      • Single Shot Capture of up to Four Event Time-Stamps
    • 361-Ball SnPb Plastic Ball Grid Array (PBGA) [GWT Suffix], 0.80-mm Ball Pitch
    • Available in Military (-55°C to 125°C) Temperature Range

    Supports Defense, Aerospace, and Medical Applications

    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Extended (–55°C/125°C) Temperature Range
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

    (1) Crystal oscillator cannot be operated beyond 105°C.

The OMAPL138B C6-Integra™ DSP+ARM® processor is a low-power applications processor based on an ARM926EJ-S™ and a C674x DSP core. It provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and 16K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core also has a 8KB RAM (Vector Table) and 64KB ROM.

The device DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB RAM shared memory is available for use by other hosts without affecting DSP performance.

For security enabled devices, TI’s Basic Secure Boot allows users to protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based “root-of-trust”, the secure boot flow guarantees a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks but can be enabled during the secure boot process during application development. The boot modules themselves are encrypted while sitting in external non-volatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. This protects the users’ IP and enables them to securely set up the system and begin device operation with known, trusted code. Basic Secure Boot utilizes either SHA-1 or SHA-256, and AES-128 for boot image validation. It also uses AES-128 for boot image encryption. The secure boot flow employs a multi-layer encryption scheme which not only protects the boot process but offers the ability to securely upgrade boot and application software code. A 128-bit device-specific cipher key, known only to the device and generated using a NIST-800-22 certified random number generator, is used to protect user encryption keys. When an update is needed, the customer creates a new encrypted image using its encryption keys. Then the device can acquire the image via an external interface, such as Ethernet, and overwrite the existing code. For more details on the supported security features or TI’s Basic Secure Boot, refer to the TMS320C674x/OMAP-L1x Processor Security User’s Guide (SPRUGQ9).

The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two inter-integrated circuit (I2C) Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSP) with FIFO buffers; two SPI interfaces with multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host port interface (HPI) ; up to 9 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed DDR2/Mobile DDR controller.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The SATA controller provides a high-speed interface to mass data storage devices. The SATA controller supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).

The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters, FPGAs or other parallel devices. The UPP supports programmable data widths between 8- to 16-bits on each of two channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE and WAIT signals to provide control for a variety of data converters.

A Video Port Interface (VPIF) is included providing a flexible video input/output port.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

The OMAPL138B C6-Integra™ DSP+ARM® processor is a low-power applications processor based on an ARM926EJ-S™ and a C674x DSP core. It provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and 16K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core also has a 8KB RAM (Vector Table) and 64KB ROM.

The device DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB RAM shared memory is available for use by other hosts without affecting DSP performance.

For security enabled devices, TI’s Basic Secure Boot allows users to protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based “root-of-trust”, the secure boot flow guarantees a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks but can be enabled during the secure boot process during application development. The boot modules themselves are encrypted while sitting in external non-volatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. This protects the users’ IP and enables them to securely set up the system and begin device operation with known, trusted code. Basic Secure Boot utilizes either SHA-1 or SHA-256, and AES-128 for boot image validation. It also uses AES-128 for boot image encryption. The secure boot flow employs a multi-layer encryption scheme which not only protects the boot process but offers the ability to securely upgrade boot and application software code. A 128-bit device-specific cipher key, known only to the device and generated using a NIST-800-22 certified random number generator, is used to protect user encryption keys. When an update is needed, the customer creates a new encrypted image using its encryption keys. Then the device can acquire the image via an external interface, such as Ethernet, and overwrite the existing code. For more details on the supported security features or TI’s Basic Secure Boot, refer to the TMS320C674x/OMAP-L1x Processor Security User’s Guide (SPRUGQ9).

The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two inter-integrated circuit (I2C) Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSP) with FIFO buffers; two SPI interfaces with multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host port interface (HPI) ; up to 9 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed DDR2/Mobile DDR controller.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The SATA controller provides a high-speed interface to mass data storage devices. The SATA controller supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).

The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters, FPGAs or other parallel devices. The UPP supports programmable data widths between 8- to 16-bits on each of two channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE and WAIT signals to provide control for a variety of data converters.

A Video Port Interface (VPIF) is included providing a flexible video input/output port.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.
open-in-new 기타 Arm 기반 프로세서 찾기
다운로드 스크립트와 함께 비디오 보기 동영상

기술 문서

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모두 보기11
유형 직함 날짜
* Data sheet OMAPL138B-EP C6000 DSP+ARM® Processor datasheet (Rev. C) 2013/04/12
* Errata OMAP-L138 C6000 DSP+ARM Processor (Revs 2.3, 2.1, 2.0, 1.1, & 1.0) Errata (Rev. M) 2014/03/21
* VID OMAPL138B-EP VID V6212605 2016/06/21
* Radiation & reliability report OMAPL138BGWTMEP Reliability Report 2013/09/05
* Radiation & reliability report OMAPL138BGWTA3R Reliability Report 2012/02/06
Application note nfBGA Packaging (Rev. C) PDF | HTML 2021/05/17
Application note Processor SDK RTOS Audio Benchmark Starter Kit 2017/04/12
User guide OMAP-L138 C6000 DSP+ARM Processor Technical Reference Manual (Rev. C) 2016/08/11
Application note Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 2015/08/13
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 2011/05/19

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

디버그 프로브

TMDSEMU200-U — XDS200 USB 디버그 프로브

XDS200은 TI 임베디드 디바이스 디버깅에 사용되는 디버그 프로브(에뮬레이터)입니다. XDS200은 저렴한 XDS110 및 고성능 XDS560v2에 비해 저렴한 비용으로 우수한 성능을 균형 있게 제공합니다. 단일 포드에서 광범위한 표준(IEEE1149.1, IEEE1149.7, SWD)을 지원합니다. 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 (...)

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디버그 프로브

TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다. SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

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디버그 프로브

TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

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드라이버 또는 라이브러리

C64X-DSPLIB — Download TMS320C64x DSP Library

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz TMS320DM8127 — DaVinci 디지털 미디어 프로세서
DSP(디지털 신호 프로세서)
SM320C6201-EP — 향상된 제품 C6201 고정 소수점 DSP SM320C6415 — 군사용 등급 C64x 고정 소수점 DSP SM320C6415-EP — 향상된 제품 C6415 고정 소수점 DSP SM320C6424-EP — EP(Enhanced Product) C6424 고정 소수점 DSP SM320C6455-EP — EP(Enhanced Product) C6455 고정 소수점 DSP SM320C6472-HIREL — 높은 안정성 제품 6 코어 C6472 고정 소수점 DSP SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP SM320C6701 — 군사용 애플리케이션을 위한 단일 코어 C67x 부동 소수점 DSP - 최대 167MHz SM320C6701-EP — 향상된 제품 C6701 부동 소수점 DSP SM320C6711D-EP — 향상된 제품 C6711D 부동 소수점 DSP SM320C6712D-EP — 향상된 제품 C6712D DSP SM320C6713B-EP — 향상된 제품 C6713 부동 소수점 DSP SM320C6727B — 군사용 등급 C6727B 부동 소수점 DSP SM320C6727B-EP — 향상된 제품 C6727 부동 소수점 DSP SM320DM642-HIREL — 높은 안정성 제품 디지털 미디어 DM642 DSP SM32C6416T-EP — 향상된 제품 C6416T 고정 소수점 DSP SMJ320C6201B — 고정 소수점 디지털 신호 프로세서, 군사용 SMJ320C6203 — 군사용 등급 C62x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6415 — 군사용 등급 C64x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6701 — 군사용 등급 C67x 부동 소수점 DSP - 세라믹 패키지 SMJ320C6701-SP — 우주 항공 등급 C6701 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V SMV320C6727B-SP — 우주 항공 등급 C6727B 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V TMS320C6201 — 고정소수점 디지털 신호 프로세서 TMS320C6202 — 고정소수점 디지털 신호 프로세서 TMS320C6202B — C62x 고정 소수점 DSP - 최대 300MHz, 384KB TMS320C6203B — C62x 고정 소수점 DSP - 최대 300MHz, 896KB TMS320C6204 — 고정소수점 디지털 신호 프로세서 TMS320C6205 — 고정소수점 디지털 신호 프로세서 TMS320C6211B — C62x 고정 소수점 DSP - 최대 167MHz TMS320C6421Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 8비트 EMIFA, 16비트 DDR2 TMS320C6424Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 16/8비트 EMIFA, 32/16비트 DDR2 TMS320C6452 — C64x+ 고정 소수점 DSP - 최대 900MHz, 1Gbps 이더넷 TMS320C6454 — C64x+ 고정 소수점 DSP - 최대 1GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6455 — C64x+ 고정 소수점 DSP - 최대 1.2GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6457 — 통신 인프라 디지털 신호 프로세서 TMS320C6701 — C67x 부동 소수점 DSP - 최대 167MHz, McBSP TMS320C6711D — C67x 부동 소수점 DSP - 최대 250MHz, McBSP, 32비트 EMIFA TMS320C6712D — C67x 부동 소수점 DSP - 최대 150MHz, McBSP, 16비트 EMIFA TMS320C6720 — C67x 부동 소수점 DSP - 200MHz, McASP, 16비트 EMIFA TMS320C6722B — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 16비트 EMIFA TMS320C6726B — C67x 부동 소수점 DSP - 최대 266MHz, McASP, 16비트 EMIFA TMS320C6727 — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 32비트 EMIFA TMS320C6727B — C67x 부동 소수점 DSP - 최대 350MHz, McASP, 32비트 EMIFA TMS320C6743 — 저전력 C674x 부동 소수점 DSP - 375MHz TMS320C6745 — 저전력 C674x 부동 소수점 DSP - 456MHz, QFP TMS320C6747 — 저전력 C674x 부동 소수점 DSP - 456MHz, PBGA
다운로드
드라이버 또는 라이브러리

C67X-DSPLIB — Download TMS320C67x DSP Library

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz TMS320DM8127 — DaVinci 디지털 미디어 프로세서
DSP(디지털 신호 프로세서)
SM320C6201-EP — 향상된 제품 C6201 고정 소수점 DSP SM320C6415 — 군사용 등급 C64x 고정 소수점 DSP SM320C6415-EP — 향상된 제품 C6415 고정 소수점 DSP SM320C6424-EP — EP(Enhanced Product) C6424 고정 소수점 DSP SM320C6455-EP — EP(Enhanced Product) C6455 고정 소수점 DSP SM320C6472-HIREL — 높은 안정성 제품 6 코어 C6472 고정 소수점 DSP SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP SM320C6701 — 군사용 애플리케이션을 위한 단일 코어 C67x 부동 소수점 DSP - 최대 167MHz SM320C6701-EP — 향상된 제품 C6701 부동 소수점 DSP SM320C6711D-EP — 향상된 제품 C6711D 부동 소수점 DSP SM320C6712D-EP — 향상된 제품 C6712D DSP SM320C6713B-EP — 향상된 제품 C6713 부동 소수점 DSP SM320C6727B — 군사용 등급 C6727B 부동 소수점 DSP SM320C6727B-EP — 향상된 제품 C6727 부동 소수점 DSP SM320DM642-HIREL — 높은 안정성 제품 디지털 미디어 DM642 DSP SM32C6416T-EP — 향상된 제품 C6416T 고정 소수점 DSP SMJ320C6201B — 고정 소수점 디지털 신호 프로세서, 군사용 SMJ320C6203 — 군사용 등급 C62x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6415 — 군사용 등급 C64x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6701 — 군사용 등급 C67x 부동 소수점 DSP - 세라믹 패키지 SMJ320C6701-SP — 우주 항공 등급 C6701 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V SMV320C6727B-SP — 우주 항공 등급 C6727B 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V TMS320C6201 — 고정소수점 디지털 신호 프로세서 TMS320C6202 — 고정소수점 디지털 신호 프로세서 TMS320C6202B — C62x 고정 소수점 DSP - 최대 300MHz, 384KB TMS320C6203B — C62x 고정 소수점 DSP - 최대 300MHz, 896KB TMS320C6204 — 고정소수점 디지털 신호 프로세서 TMS320C6205 — 고정소수점 디지털 신호 프로세서 TMS320C6211B — C62x 고정 소수점 DSP - 최대 167MHz TMS320C6421Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 8비트 EMIFA, 16비트 DDR2 TMS320C6424Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 16/8비트 EMIFA, 32/16비트 DDR2 TMS320C6452 — C64x+ 고정 소수점 DSP - 최대 900MHz, 1Gbps 이더넷 TMS320C6454 — C64x+ 고정 소수점 DSP - 최대 1GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6455 — C64x+ 고정 소수점 DSP - 최대 1.2GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6457 — 통신 인프라 디지털 신호 프로세서 TMS320C6701 — C67x 부동 소수점 DSP - 최대 167MHz, McBSP TMS320C6711D — C67x 부동 소수점 DSP - 최대 250MHz, McBSP, 32비트 EMIFA TMS320C6712D — C67x 부동 소수점 DSP - 최대 150MHz, McBSP, 16비트 EMIFA TMS320C6720 — C67x 부동 소수점 DSP - 200MHz, McASP, 16비트 EMIFA TMS320C6722B — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 16비트 EMIFA TMS320C6726B — C67x 부동 소수점 DSP - 최대 266MHz, McASP, 16비트 EMIFA TMS320C6727 — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 32비트 EMIFA TMS320C6727B — C67x 부동 소수점 DSP - 최대 350MHz, McASP, 32비트 EMIFA TMS320C6743 — 저전력 C674x 부동 소수점 DSP - 375MHz TMS320C6745 — 저전력 C674x 부동 소수점 DSP - 456MHz, QFP TMS320C6747 — 저전력 C674x 부동 소수점 DSP - 456MHz, PBGA
다운로드
드라이버 또는 라이브러리

C67X-MATHLIB — DSP Math Library for C67x Floating Point Devices

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz
DSP(디지털 신호 프로세서)
DM505 — 비전 분석용 SoC 15mm 패키지 SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP SM320C6727B — 군사용 등급 C6727B 부동 소수점 DSP SM320C6727B-EP — 향상된 제품 C6727 부동 소수점 DSP SMV320C6727B-SP — 우주 항공 등급 C6727B 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V TMS320C6701 — C67x 부동 소수점 DSP - 최대 167MHz, McBSP TMS320C6711D — C67x 부동 소수점 DSP - 최대 250MHz, McBSP, 32비트 EMIFA TMS320C6712D — C67x 부동 소수점 DSP - 최대 150MHz, McBSP, 16비트 EMIFA TMS320C6720 — C67x 부동 소수점 DSP - 200MHz, McASP, 16비트 EMIFA TMS320C6722B — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 16비트 EMIFA TMS320C6726B — C67x 부동 소수점 DSP - 최대 266MHz, McASP, 16비트 EMIFA TMS320C6727 — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 32비트 EMIFA TMS320C6727B — C67x 부동 소수점 DSP - 최대 350MHz, McASP, 32비트 EMIFA TMS320C6743 — 저전력 C674x 부동 소수점 DSP - 375MHz TMS320C6745 — 저전력 C674x 부동 소수점 DSP - 456MHz, QFP TMS320C6747 — 저전력 C674x 부동 소수점 DSP - 456MHz, PBGA
다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.
시작 다운로드 옵션
소프트웨어 코덱

C66XCODECSPCH — C66x Speech Codecs - Software and Documentation

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz SMOMAPL138B-HIREL — 고신뢰성 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 375MHz
DSP(디지털 신호 프로세서)
DM505 — 비전 분석용 SoC 15mm 패키지 SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP
다운로드 옵션
소프트웨어 코덱

C66XCODECSVID — C6678 Video Codecs - Software and Documentation

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAPL137-HT — 고온 저전력 C674x 부동 소수점 DSP + Arm 프로세서 - 최대 456MHz OMAPL138B-EP — 향상된 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 345MHz SMOMAPL138B-HIREL — 고신뢰성 제품 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 375MHz
DSP(디지털 신호 프로세서)
DM505 — 비전 분석용 SoC 15mm 패키지 SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP
다운로드 옵션
설계 툴

PROCESSORS-3P-SEARCH — Arm 기반 MPU, arm 기반 MCU 및 DSP 타사 검색 툴

TI는 여러 회사와의 협력을 통해 TI 프로세서를 사용하여 광범위한 소프트웨어, 툴 및 SOM을 제공해서 생산 단계로 가는 속도를 높이고 있습니다. 이 검색 툴을 다운로드하여 타사 솔루션을 빠르게 검색하고 필요에 맞는 올바른 타사를 찾아보세요. 여기에 나열된 소프트웨어, 툴 및 모듈은 텍사스 인스트루먼트가 아닌 독립적인 타사에서 생산 및 관리하고 있습니다.

검색 툴은 다음과 같이 제품 유형별로 분류되어 있습니다.

  • 툴에는 IDE/컴파일러, 디버그 및 추적, 시뮬레이션 및 모델링 소프트웨어, 플래시 프로그래머가 포함되어 있습니다.
  • OS에는 (...)
다운로드
거버(Gerber) 파일

OMAPL138 LCD Kit (Schematics, BOM , Layout, and Gerber Files) v.A7a

SPRCAF3.ZIP (4387 KB)
다운로드
패키지 핀 다운로드
NFBGA (GWT) 361 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

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