TB5T1
- Functional Replacement for the Agere BTF1A
- Driver Features
- Third-State Logic Low Output
- ESD Protection HBM > 3 kV, CDM > 2 kV
- No Line Loading when VCC = 0
- Capable of Driving 50- loads
- 2.0-ns Maximum Propagation Delay
- 0.2-ns Output Skew (typical)
- Receiver Features
- High-Input Impedance Approximately 8 k
- 4.0-ns Maximum Propagation Delay
- 50-mV Hysteresis
- Slew Rate Limited (1 ns min 80% to 20%)
- ESD Protection HBM > 3 kV, CDM > 2 kV
- -1.1-V to 7.1-V Input Voltage Range
- Common Device Features
- Common Enable for Each Driver/Receiver Pair
- Operating Temperature Range: -40°C to 85°C
- Single 5.0 V ± 10% Supply
- Available in Gull-Wing SOIC (JEDEC MS-013, DW) and SOIC (D) Package
The TB5T1 device is a dual differential driver/receiver circuit that transmits and receives digital data over balanced transmission lines. The dual drivers translate input TTL logic levels to differential pseudo-ECL output levels. The dual receivers convert differential-input logic levels to TTL output levels. Each driver or receiver pair has its own common enable control allowing serial data and a control clock to be transmitted and received on a single integrated circuit. The TB5T1 requires the customer to supply termination resistors on the circuit board.
The power-down loading characteristics of the receiver input circuit are approximately 8 k relative to the power supplies; hence, it does not load the transmission line when the circuit is powered down.
In circuits with termination resistors, the line remains impedance- matched when the circuit is powered down. The driver does not load the line when it is powered down.
All devices are characterized for operation from -40°C to 85°C.
The logic inputs of this device include internal pull-up resistors of approximately 40 k that are connected to VCC to ensure a logical high level input if the inputs are open circuited.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TB5T1, Dual Differential PECL Driver/Receiver datasheet (Rev. C) | 2007/10/23 |
설계 및 개발
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TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
패키지 | 핀 | 다운로드 |
---|---|---|
SOIC (D) | 16 | 옵션 보기 |
SOIC (DW) | 16 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치