TPS650372-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with following results:
- Device operates from 4V to 18V input supply
- Input supply 36V tolerant
- Device temperature grade 1: -40°C to +125°C
- Functional Safety -Compliant targeted
- Developed for functional safety applications
- Documentation to aid ISO26262 and IEC61508 system design available upon product release
- Systematic capability and hardware integrity up to ASIL-B targeted
- Under/overvoltage monitors with Built-In Self-Test
- Temperature warning and thermal shutdown
- Mid-VIN step-down converter BUCK1
- VIN range from 4V to 18V
- VOUT range from 3V to 5V
- Output current up to 1.5A for normal operation
- Output current up to 2.5A for heater mode (limited temperature and VSYS)
- 2.2MHz switching frequency
- Two Low-VIN step-down converters BUCK2, BUCK3:
- VIN range from 2.5V to 5.5V
- VOUT range from 0.8V to 1.8V
- Output current 2A for BUCK2, 1A for BUCK3
- 2.2MHz or 4.4MHz switching frequency
- One low dropout (LDO) regulator:
- VIN range from 2.5V to 5.5V
- VOUT range from 1.2V to 3.3V
- Up to 300mA output current
- Low noise and high PSRR
- 3mm × 2.5mm 18-pin WQFN-HR with wettable flanks
The TPS65037x-Q1 device is a highly integrated power management IC for automotive camera modules. This device combines three step-down converters and one low-dropout (LDO) regulator. The BUCK1 step-down converter operating input voltage range is up to 18V. The device can tolerate input voltage up to 36V (not recommended for a prolonged time period). All converters operate in a forced fixed-frequency PWM mode and support optional Spread-Spectrum Modulation (SSM) for EMI reduction. The LDO can supply 300mA and operate with an input voltage range from 2.5V to 5.5V. The TPS65037x-Q1 supports I2C control interface with interrupt pin or, alternatively, three GPIOs.
The TPS65037x-Q1 is available in a 18-pin WQFN-HR package (3mm × 2.5mm).
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 날짜 |
|---|---|---|---|---|
| * | Data sheet | TPS65037x-Q1 Automotive Camera PMIC datasheet | PDF | HTML | 2026/01/07 |
설계 및 개발
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TPS65037EVM — TPS65037x-Q1 평가 모듈
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| WQFN-HR (VAT) | 18 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.