TPSM53604
- Functional Safety-Capable
- 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
- Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided)
- Low EMI: meets CISPR11 radiated emissions
- Excellent thermal performance: up to 20 W output power at 85°C, no airflow
- Standard footprint: single large thermal pad and all pins accessible from perimeter
- Input voltage range: 3.8 V to 36 V
- Output voltage range: 1 V to 7 V
- Efficiency up to 95%
- Power-good flag
- Precision enable
- Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
- Operating IC junction range: –40°C to +125°C
- Operating ambient range: –40°C to +105°C
- Shock and vibration tested to Mil-STD-883D
- Pin compatible with: 3-A TPSM53603 and 2-A TPSM53602
- Create a custom design using the TPSM53604 with the WEBENCH Power Designer
- Download the EVM Design Files for fast board design
The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. C) | PDF | HTML | 2021. 9. 30 | |
| 애플리케이션 노트 | Soldering Considerations for Power Modules (Rev. C) | PDF | HTML | 2024. 3. 14 | ||
| 백서 | Addressing Factory Automation Challenges with Innovations in Power Design | PDF | HTML | 2021. 9. 28 | ||
| 기능 안전 정보 | TPSM53604 Functional Safety, FIT Rate, Failure Mode Distribution, and Pin FMA | PDF | HTML | 2021. 8. 24 | ||
| 기술 문서 | Powering medical imaging applications with DC/DC buck converters | PDF | HTML | 2020. 11. 24 | ||
| 애플리케이션 노트 | Soldering Requirements for BQFN Packages (Rev. C) | 2020. 3. 5 | |||
| 기술 문서 | 35 years later, APEC continues to set the tone for innovation in power management | PDF | HTML | 2020. 2. 27 | ||
| 애플리케이션 노트 | Practical Thermal Design With DC/DC Power Modules (Rev. A) | 2019. 11. 20 | |||
| 백서 | Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging | 2019. 11. 19 | |||
| 애플리케이션 노트 | Using the TPSM5360x for an Inverting Buck-Boost Application | 2019. 10. 29 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TPSM53604EVM — 3.8V~36V 입력, 4A 전원 모듈 평가 보드
SNVR482 — TPSM53604 EVM Design Files
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| B3QFN (RDA) | 15 | Ultra Librarian |
주문 및 품질
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.