首頁 電源管理 功率級 Si 功率級

CSD95420RCB

現行

50A 峰值連續同步降壓 NexFET™ 智慧功率級

產品詳細資料

Rating Catalog VDS (V) 20 Ploss current (A) 30 Features Analog temperature output, Catastrophic over-current protection, Cycle-by-cycle over-current protection, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Integrated ringing reduction, Negative over-current protection, Powerstack vertical FET integration, Ultra-low inductance package Operating temperature range (°C) -40 to 125
Rating Catalog VDS (V) 20 Ploss current (A) 30 Features Analog temperature output, Catastrophic over-current protection, Cycle-by-cycle over-current protection, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Integrated ringing reduction, Negative over-current protection, Powerstack vertical FET integration, Ultra-low inductance package Operating temperature range (°C) -40 to 125
VQFN-CLIP (RCB) 27 20 mm² 5 x 4
  • 50-A peak continuous current
  • Over 94% system efficiency at 15-A
  • High-frequency operation (up to 1.75 MHz)
  • Diode emulation function
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized deadtime for shoot-through protection
  • QFN package
    • High-density
    • 4 mm × 5 mm
    • Ultra-low-inductance
    • System-optimized PCB footprint
    • Thermally enhanced tooling
    • RoHS compliant
    • Lead-free terminal plating
    • Halogen Free
  • 50-A peak continuous current
  • Over 94% system efficiency at 15-A
  • High-frequency operation (up to 1.75 MHz)
  • Diode emulation function
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized deadtime for shoot-through protection
  • QFN package
    • High-density
    • 4 mm × 5 mm
    • Ultra-low-inductance
    • System-optimized PCB footprint
    • Thermally enhanced tooling
    • RoHS compliant
    • Lead-free terminal plating
    • Halogen Free

The CSD95420RCBNexFET™ power stage is highly optimized for high-power, high-density synchronous buck converters. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4 mm × 5 mm outline package. The device integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. The optimized PCB footprint helps reduce design time and simplifies the completion of the overall system design.

The CSD95420RCBNexFET™ power stage is highly optimized for high-power, high-density synchronous buck converters. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4 mm × 5 mm outline package. The device integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. The optimized PCB footprint helps reduce design time and simplifies the completion of the overall system design.

下載 觀看有字幕稿的影片 影片
索取更多資訊

提供完整產品規格表和其它資訊。立即索取

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 1
類型 標題 日期
* Data sheet CSD95420RCB Synchronous Buck NexFET Smart Power Stage datasheet 2020年 10月 7日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFN-CLIP (RCB) 27 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片