CSD95472Q5MC
- 60-A Continuous Operating Current Capability
- 94.4% System Efficiency at 1.2 V / 30 A
- Low Power Loss of 2.3 W at 30 A
- High-Frequency Operation (up to 1.25 MHz)
- Diode Emulation Mode With FCCM
- Temperature-Compensated Bidirectional Current
Sense - Analog Temperature Output (600 mV at 0°C)
- Fault Monitoring
- High-Side Short, Overcurrent, and
Overtemperature Protection
- High-Side Short, Overcurrent, and
- 3.3-V and 5-V PWM Signal Compatible
- Tri-State PWM Input
- Integrated Bootstrap Diode
- Optimized Deadtime for Shoot-Through Protection
- High-Density SON 5 × 6 mm Footprint
- Ultralow Inductance Package
- System-Optimized PCB Footprint
- DualCool™ Packaging
- RoHS Compliant – Lead-Free Terminal Plating
- Halogen Free
The CSD95472Q5MC NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
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檢視所有 1 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | CSD95472Q5MC Synchronous Buck NexFET Smart Power Stage datasheet | PDF | HTML | 2016年 2月 12日 |
設計與開發
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參考設計
PMP20176 — 適用於 Intel Stratix 10 GX FPGA 的四相 140A 參考設計
此參考設計著重於提供精巧、高效能的多相解決方案，適合供電給 Intel® Stratix® 10 GX 現場可程式化邏輯閘陣列 (FPGA)，並特別強調 SG2800-I1V 變體。整合式 PMBus™ 可輕鬆設定輸出電壓，並遙測主要設計參數。此設計可實現電源供應的編程、配置、Smart VID 調整及控制，同時提供輸入與輸出電壓、電流、功率及溫度監控。TI 的 Fusion Digital Power™ Designer 用於 FPGA 電源設計的編程、監控、驗證和特性分析。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| VSON-CLIP (DMC) | 12 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。