CSDM65295T
- Topside-cooled 9 mm x 10 mm x 5 mm LGA package, industry common footprint
- Integrated inductor
- High output current capability:
- Peak current: 180A
- Continuous current: 130A RMS
- (Subject to thermal boundary condition)
- Operating VIN input voltage: 4.5V to 16V
- Operating VDD Bias: 4.5V to 5.5V
- High-frequency operation (up to 2MHz)
- Integrated clamping circuitry for avalanche free operation
- Temperature compensated bi-directional current sense with current mode reporting (5µA/A)
- Body braking mode (BB)
- Forced continuous conduction mode (FCCM) operation
- Green, RoHS compliant without exemption, and completely Pb free
- Fault detection
- High-side short (HSS)
- Fault protection
- Over temperature (OT)
- Cycle-by-cycle negative over current limiting (NOC)
- Over current protection (OCP)
- BOOT UVLO
The CSDM65295x family of devices are 2-phase smart power stage modules with high peak current capability. The device family is highly optimized design for use in high-power, high-density synchronous buck converter applications. This product family integrates the driver IC and power MOSFETs into one Pb-free monolithic design to complete the power stage switching function. There are VIN and VDD bypass capacitors integrated into the package for minimum loop inductance and improved ringing.
This combination produces high-current, high-efficiency, and high-speed switching capability in a small industry standard 9mm × 10mm × 5 mm footprint.
CSDM65295x integrates accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. This power stage module also includes cycle-by-cycle current limiting, over temperature and short circuit protection, and is designed to be compatible with TPS537xx series controllers.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | CSDM65295x Dual-Phase Buck Smart Power Stage Module datasheet | PDF | HTML | 2026年 2月 2日 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| QFN-FCMOD (VCQ) | 72 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。