DS91M047
- DC - 125 MHz / 250 Mbps Low Jitter, Low Skew, Low Power Operation
- Conforms to TIA/EIA-899 M-LVDS Standard
- Controlled Transition Times (2 ns typ) Minimize Reflections
- 8 kV ESD on M-LVDS Pins Protects Adjoining Components
- Flow-Through Pinout Simplifies PCB Layout
- Industrial Operating Temperature Range (−40°C to +85°C)
- Available in a Space Saving SOIC-16 Package
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The DS91M047 is a high-speed quad M-LVDS line driver designed for driving clock or data signals to up to four multipoint networks.
M-LVDS (Multipoint LVDS) is a new family of bus interface devices based on LVDS technology specifically designed for multipoint and multidrop cable and backplane applications. It differs from standard LVDS in providing increased drive current to handle double terminations that are required in multi-point applications. Controlled transition times minimize reflections that are common in multipoint configurations due to unterminated stubs.
The DS91M047 accepts LVTTL/LVCMOS input levels and translates them to M-LVDS signal levels with transition times of greater than 1 ns. The device provides the DE and DE inputs that are ANDed together and control the TRI-STATE outputs. The DE and DE inputs are common to all four drivers.
The DS91M047 has a flow-through pinout for easy PCB layout. The DS91M047 provides a new alternative for high speed multipoint interface applications. It is packaged in a space saving SOIC-16 package.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DS91M047 125 MHz Quad M-LVDS Line Driver datasheet (Rev. E) | 2013年 4月 16日 | |
| Application brief | How Far, How Fast Can You Operate MLVDS? | 2018年 8月 6日 | ||
| Application note | Introduction to M-LVDS (TIA/EIA-899) (Rev. A) | 2013年 1月 3日 | ||
| EVM User's guide | 125 MHz Quad M-LVDS Driver Evaluation Board | 2012年 1月 26日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點