TPS2291L02
- Integrated Single Channel Load Switch
- Input operating voltage range (VIN): 1.05V – 5.5V
- Low On-Resistance (RON)
- RON = 18.6mΩ (Typ) at VIN ≥ 3.3V
- RON = 20.1mΩ (Typ) at VIN = 1.8V
- RON = 23.3mΩ (Typ) at VIN = 1.05V
- Low power consumption:
- ON state (IQ): 90nA (typ.)
- OFF state (ISD): 1.6nA (typ.)
- Maximum continuous current: 2A
- Controlled Turn on time of 130µs
- Quick Output Discharge (QOD): 235Ω (typ.)
- Thermal shutdown for self protection
- Smart EN pin pulldown (RPD,EN):
-
- EN ≥ VIH (ION): 25nA (max.)
- EN ≤ VIL (RPD,ON): 530kΩ (typ)
- Ultra small Wafer Chip Scale Package
- 0.616mm × 0.616mm , 0.35mm pitch, 0.35mm Height DSBGA(YCJ)
- ESD performance tested per JESD 22
- 2kV HBM and 1kV CDM
The EN pin controls the state of the switch. The EN pin is compatible with standard GPIO logic threshold so the device can be used in a wide variety of applications. When power is first applied to VIN, a Smart Pulldown is used to keep the EN pin from floating until the system sequencing is complete. After the EN pin is deliberately driven high (≥ VIH), the Smart Pulldown is disconnected to prevent unnecessary power loss. See the below table when the EN Pin Smart Pulldown is active.
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檢視所有 2 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPS22991L02 5.5V, 2A, 22mΩ On-Resistance Ultra Low IQ Load Switch With Quick Output discharge datasheet | PDF | HTML | 2025年 11月 10日 |
| Certificate | TPS2291L02-EVM EU Declaration of Conformity (DoC) | 2025年 9月 22日 |
設計與開發
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開發板
TPS2291L02-EVM — TPS2291L02 Evaluation Module
The TPS2291L02 evaluation module (EVM) is a printed circuit board (PCB) containing the TPS2291L02 load switch device. The VIN and VOUT connections to the device and the PCB layout routing are capable of handling high continuous currents and provide a low-resistance pathway into and out of the (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YCJ) | 4 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。