TMP275AIDGKT
±0.5°C Temperature Sensor with I2C/SMBus Interface in Industry Std LM75 Form Factor & Pinout
Packaging
| Package | PIN: | VSSOP (DGK) | 8 |
|---|---|
| Temp: | Q (-40 to 125) |
| Carrier: | Cut Tape |
| Qty | Price |
|---|---|
| 1-9 | $2.42 |
| 10-24 | $2.17 |
| 25-99 | $2.02 |
| 100-249 | $1.77 |
| 250-499 | $1.66 |
| 500-749 | $1.41 |
| 750-999 | $1.19 |
| 1000+ | $1.14 |
Features
- High Accuracy:
- ±0.5°C (Maximum) From −20°C to 100°C
- ±1°C (Maximum) From−40°C to 125°C
- Low Quiescent Current:
- 50 µA (Typical)
- 0.1-µA Standby
- Resolution: 9 to 12 Bits, User-Selectable
- Digital Output: SMBus™, Two-Wire, and I2C Interface Compatibility
- 8 I2C/SMBus Addresses
- Wide Supply Range: 2.7 V to 5.5 V
- Small VSSOP-8 and SOIC-8 Packages
- No Specified Power-up Sequence Required; Two-Wire Bus Pullups May Be Enabled Before V+
All trademarks are the property of their respective owners.
Texas Instruments TMP275AIDGKT
The TMP275 is a ±0.5°C accurate integrated digital temperaturesensor with a 12-bit analog-to-digital converter (ADC) that can operate as low as 2.7-V supplyvoltage and is pin- and register-compatible with the Texas Instruments LM75, TMP75, TMP75B, andTMP175 devices. This device is available in SOIC-8 and VSSOP-8 packages, and it requires noexternal components to sense the temperature. The TMP275 is capable of reading temperatures with amaximum resolution of 0.0625°C (12 bits) and as low as 0.5°C (9 bits), which allows the user tomaximize efficiency by programming for higher resolution or faster conversion time. The device isspecified over a temperature range of –40°C to 125°C.
The TMP275 device features SMBus and two-wire interface compatibility, and allows up toeight devices on the same bus with the SMBus overtemperature alert function. The factory-calibratedtemperature accuracy and the noise-immune digital interface make the TMP275 the preferred solutionfor temperature compensation of other sensors and electronic components, without the need foradditional system-level calibration or elaborate board layout for distributed temperaturesensing.