SNVSCF4 July   2025 LM25139-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1. 4.1 Wettable Flanks
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings 
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Voltage Range (VIN )
      2. 6.3.2  High-Voltage Bias Supply Regulator (VCC)
      3. 6.3.3  Precision Enable (EN)
      4. 6.3.4  Power-Good Monitor (PG)
      5. 6.3.5  Switching Frequency (RT)
      6. 6.3.6  Dual Random Spread Spectrum (DRSS)
      7. 6.3.7  Soft Start
      8. 6.3.8  Output Voltage Setpoint (FB)
      9. 6.3.9  Minimum Controllable On Time
      10. 6.3.10 Error Amplifier and PWM Comparator (FB)
      11. 6.3.11 Slope Compensation
      12. 6.3.12 Inductor Current Sense (ISNS, VOUT)
        1. 6.3.12.1 Shunt Current Sensing
        2. 6.3.12.2 Inductor DCR Current Sensing
        3. 6.3.12.3 Hiccup-Mode Current Limiting
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode
      2. 6.4.2 Forced PWM and Synchronization (FPWM/SYNC)
      3. 6.4.3 Thermal Shutdown
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power Train Components
        1. 7.1.1.1 Buck Inductor
        2. 7.1.1.2 Output Capacitors
        3. 7.1.1.3 Input Capacitors
        4. 7.1.1.4 Power MOSFETs
        5. 7.1.1.5 EMI Filter
      2. 7.1.2 Error Amplifier and Compensation
    2. 7.2 Typical Applications
      1. 7.2.1 Design 1 – High Efficiency 2.2MHz Synchronous Buck Regulator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 7.2.1.2.2 Buck Inductor
          3. 7.2.1.2.3 Current-Sense Components
          4. 7.2.1.2.4 Output Capacitors
          5. 7.2.1.2.5 Input Capacitors
          6. 7.2.1.2.6 Frequency Set Resistor
          7. 7.2.1.2.7 Feedback Resistors
          8. 7.2.1.2.8 Compensation Components
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Design 2 – High-Efficiency, 440kHz, Synchronous Buck Regulator
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Power Stage Layout
        2. 7.4.1.2 Gate Drive Layout
        3. 7.4.1.3 PWM Controller Layout
        4. 7.4.1.4 Thermal Design and Layout
        5. 7.4.1.5 Ground Plane Design
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
        1. 8.2.1.1 Low-EMI Design Resources
        2. 8.2.1.2 Thermal Design Resources
        3. 8.2.1.3 PCB Layout Resources
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Wettable Flanks

100% automated visual inspection (AVI) post-assembly is typically required to meet requirements for high reliability and robustness. Standard quad-flat no-lead (QFN) packages do not have solderable or exposed pins and terminals that are easily viewed. Visually determining whether or not the package is successfully soldered onto the printed-circuit board (PCB) is therefore difficult. The wettable-flank process was developed to resolve the issue of side-lead wetting of leadless packaging. The LM25139-Q1 is assembled using a 36-pin VQFN package with wettable flanks to provide a visual indicator of solderability, which reduces inspection time and manufacturing costs.